A kind of multi-layer anisotropic conductive adhesive film and its manufacturing method

A technology of anisotropic conductive adhesive and conductive adhesive layer, applied in chemical instruments and methods, layered products, electronic equipment, etc., can solve problems such as poor anisotropic conduction effect, void shielding effect, and influence on conduction performance, etc. Achieve the best oxidation resistance and conductivity, good grounding stability, and improve the effect of conduction performance
CN107914435BActive Publication Date: 2019-10-29KUSN APLUS TEC CORP
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Patent Information

Authority / Receiving Office
CN ยท China
Patent Type
Patents(China)
Current Assignee / Owner
KUSN APLUS TEC CORP
Publication Date
2019-10-29

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Abstract

The invention discloses a multi-layer anisotropic conductive adhesive film. The multi-layer anisotropic conductive adhesive film comprises an upper conductive adhesive layer, a thin metal layer and alower conductive adhesive layer, wherein the thin metal layer is formed between the upper conductive adhesive layer and the lower conductive adhesive layer and is 50-3000 nm thick, and a release filmlayer or a carrier film layer is formed below the lower conductive adhesive layer. The multi-layer anisotropic conductive adhesive film has high conductivity and high electromagnetic wave shielding function. Metal conductive particles contained in the upper conductive adhesive layer and the lower conductive adhesive layer are in various shapes, and the thickness of the thin metal layer is nanoscale; when the conductive adhesive film is conducted, the metal conductive particles tend to flow in multiple directions, and conduction in all directions can be achieved; meanwhile, the metal conductiveparticles can pierce the thin metal layer, the number of the metal conductive particles can be reduced under the same conducting force, metal powder pollution is reduced, and the production cost is reduced.
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Description

technical field

[0001] The invention belongs to the technical field of conductive adhesives for printed circuit boards, and in particular relates to a multilayer anisotropic conductive adhesive film. Background technique

[0002] The development trend of electronic and communication products requires circuit substrate components to develop towards light, thin, small and highly integrated, and the frequency band of transmission signals is getting wider and wider, resulting in more and more serious electromagnetic interference; at the same time, considering the safety of electronic circuit components, the electronic The grounding reliability of the circuit components in the product has put forward new requirements. Although the conductive adhesive products commonly used in the market can be connected to the grounding holes reserved in general printed circuit boards, at the same time, the grounding hole will be filled by the conductive adhesive. Too full will affect the design ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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