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Display substrate motherboard, display substrate, manufacturing method and display device

A display substrate and manufacturing method technology, which is applied in the fields of final product manufacturing, sustainable manufacturing/processing, semiconductor/solid-state device manufacturing, etc., can solve problems such as cracks, failure of flexible display devices, etc., and achieve the effect of enhancing the packaging effect

Active Publication Date: 2018-04-17
BOE TECH GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] Existing flexible display substrate motherboards are generally cut by laser. Due to the phenomenon of excessive local temperature during laser cutting, cracks will appear on the inorganic layer at the edge of the flexible display substrate due to instantaneous thermal expansion and contraction. Cracks penetrate inward, leading to failure of flexible display devices

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  • Display substrate motherboard, display substrate, manufacturing method and display device
  • Display substrate motherboard, display substrate, manufacturing method and display device
  • Display substrate motherboard, display substrate, manufacturing method and display device

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Embodiment Construction

[0035] In order to make the technical problems, technical solutions and advantages to be solved by the embodiments of the present invention clearer, the following will describe in detail with reference to the drawings and specific embodiments.

[0036] Existing flexible display substrate motherboards are generally cut by laser, such as figure 1 As shown, the existing flexible display substrate motherboard includes: a flexible substrate 1, an inorganic layer 2 located on the flexible substrate 1 and a plurality of display elements 3 located on the inorganic layer 2, and a plurality of the display elements 3 Arranged at intervals, a laser cutting area is provided between the plurality of display elements 3, and a laser is used to cut the mother board of the display substrate to form a single display substrate. Due to the phenomenon that the local temperature is too high during laser cutting, such as figure 1 As shown, after cutting, the inorganic layer 2 at the edge of the displ...

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PUM

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Abstract

The invention provides a display substrate motherboard, a display substrate, a manufacturing method and a display device and belongs to the technical field of display. The display substrate motherboard comprises a substrate, an inorganic layer located on the substrate, and a plurality of display elements located on the inorganic layer, wherein the plurality of display elements are arranged at intervals; laser cutting areas are arranged between the plurality of display elements; and the inorganic layer is provided with protection patterns for covering the laser cutting areas. Through the display substrate motherboard, the inorganic layer on the edge of the display substrate can be prevented from cracking, thereby preventing external water vapor from infiltrating inwards along a crack and ensuring that the display substrate does not fail.

Description

technical field [0001] The present invention relates to the field of display technology, in particular to a display substrate motherboard, a display substrate and a manufacturing method, and a display device. Background technique [0002] Currently, bendable displays can be realized through liquid crystal display (LCD) and organic light emitting diode (OLED) displays. Among them, benefiting from the characteristic of self-luminescence, the OLED display fabricated on the flexible substrate 1 is easier to realize a bendable display with a smaller bending radius. Therefore, the fabrication of OLED displays based on flexible substrates 1 has attracted extensive attention. [0003] Affected by factors such as lightness, thinness and ease of bending of flexible displays, there are many demands for new bendable terminal devices. The bending of the flexible display product may be the bending of the display element, or the bending of the control circuit area of ​​the display elemen...

Claims

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Application Information

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IPC IPC(8): H01L27/12H01L27/32H01L51/00H01L21/77
CPCH01L27/1218H01L27/1262H10K77/111H10K59/1201H10K59/873H10K71/421Y02E10/549Y02P70/50H10K71/851H10K2102/311H10K71/00H10K50/844
Inventor 王涛孙韬张嵩
Owner BOE TECH GRP CO LTD