Barrier film constructions
A barrier film and structure technology, applied in the direction of film/sheet adhesive, semiconductor/solid device manufacturing, semiconductor/solid device parts, etc., can solve the problem of damage to the flexibility of the device
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[0063] The following examples further explain the purpose and beneficial effects of the present invention, but the specific materials and amounts listed in these examples, as well as other conditions and details, should not be construed as improper limitations of the present invention.
[0064] These examples are for illustrative purposes only, and are not intended to limit the scope of the appended claims. All parts, percentages, ratios, etc. in the examples, as well as in the remainder of the specification, are by weight unless otherwise indicated. Solvents and other reagents used were purchased from Sigma-Aldrich Chemical Company, St. Louis, MO unless otherwise noted.
[0065] Material
[0066] Escorez 5300 hydrogenated petroleum hydrocarbon resin was purchased from ExxonMobil Chemical Company (Houston, TX). Clearon P105 was obtained from Yasuhara Chemical (Fuchu-city, Japan). Polyisobutylene having the following formula weights: (i) 400,000 g / mol (Oppanol B50 SF); (ii...
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