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Barrier film constructions

A barrier film and structure technology, applied in the direction of film/sheet adhesive, semiconductor/solid device manufacturing, semiconductor/solid device parts, etc., can solve the problem of damage to the flexibility of the device

Active Publication Date: 2018-04-17
3M INNOVATIVE PROPERTIES CO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Glass is a commonly used encapsulation material, but glass significantly compromises device flexibility

Method used

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Embodiment

[0063] The following examples further explain the purpose and beneficial effects of the present invention, but the specific materials and amounts listed in these examples, as well as other conditions and details, should not be construed as improper limitations of the present invention.

[0064] These examples are for illustrative purposes only, and are not intended to limit the scope of the appended claims. All parts, percentages, ratios, etc. in the examples, as well as in the remainder of the specification, are by weight unless otherwise indicated. Solvents and other reagents used were purchased from Sigma-Aldrich Chemical Company, St. Louis, MO unless otherwise noted.

[0065] Material

[0066] Escorez 5300 hydrogenated petroleum hydrocarbon resin was purchased from ExxonMobil Chemical Company (Houston, TX). Clearon P105 was obtained from Yasuhara Chemical (Fuchu-city, Japan). Polyisobutylene having the following formula weights: (i) 400,000 g / mol (Oppanol B50 SF); (ii...

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Abstract

A barrier film construction comprises an ultra-barrier film and a barrier adhesive. The adhesive layer comprises a barrier adhesive composition comprising a resin system and organically modified nanoclay; wherein the resin system comprises a first polyisobutylene resin having a viscosity average molecular weight of about 100,000 to about 1,200,000 g / mol and tackifier.

Description

technical field [0001] The present invention relates to barrier film constructions and organic electronic devices encapsulated with barrier film constructions. Background technique [0002] Organic electronics need protection from moisture and oxygen in order to provide a long enough lifetime for commercial applications. Encapsulation materials are therefore utilized to protect the device from moisture and oxygen. Glass is a commonly used encapsulation material, but glass significantly compromises device flexibility. It may therefore be desirable to replace glass with flexible barrier films. Flexible barrier films can enable flexible devices as well as lighter, thinner, stronger rigid devices. [0003] Flexible barrier films have been commercialized for general use in organic electronics. Adhesives are typically used to laminate flexible barrier films to the device to be protected. It is therefore important that the adhesive also has good barrier properties to minimize ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/52C08L23/20C08L93/04C09J7/30
CPCC09J123/22C08L93/04C08K3/346C08L23/22H10K59/873H10K59/8722C08L23/20H01L21/02118H01L23/293H10K50/844H10K85/141H10K85/151H10K2102/00C09J7/30C08K9/04C09J11/04C09J11/06C09J2203/326C09J2400/10C09J2423/00
Inventor 雅各布·P·约翰逊弗雷德·B·麦考密克亚当·J·默勒理查德·J·波科尔尼丹尼尔·J·施密特
Owner 3M INNOVATIVE PROPERTIES CO