Mount element detection method based on color image segmentation and gradient projection positioning

A color image and gradient projection technology, applied in image analysis, image enhancement, image data processing, etc., can solve the problems of low positioning accuracy and high false detection rate, and achieve the effect of being less susceptible to noise interference and good robustness

Active Publication Date: 2018-04-20
ANHUI UNIVERSITY OF TECHNOLOGY
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Problems solved by technology

[0007] The purpose of the present invention is to solve the problem that the positioning accuracy of the existing mounting component defect detection scheme is not high, resulting in a high false detection rate, and provides a mounting component detection method based on color image segmen

Method used

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  • Mount element detection method based on color image segmentation and gradient projection positioning
  • Mount element detection method based on color image segmentation and gradient projection positioning

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Embodiment 1

[0045] For the detection of surface mount electronic components as circuit board components, the placement quality of the solder joints directly affects the performance of the circuit board. Because the traditional manual visual inspection has the disadvantages of high false positives and low efficiency, automatic optical It is the current main trend to detect the solder joints of mounted components automatically. This embodiment provides a detection method for mounted components based on color image segmentation and gradient projection positioning, combining figure 1 , which specifically includes the following processes:

[0046] Component defect detection

[0047] (1) Training phase: Get the PCB board picture, and use the device of 3CCD camera, ring-shaped red, green and blue LED structure light source and lens to collect the image of the solder joints on the circuit board. Then make the MARK point, and predetermine the characteristic parameters of the solder joint image ac...

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Abstract

The invention discloses a mount element detection method based on color image segmentation and gradient projection positioning, and belongs to the technical field of automatic optical detection of mount elements. The mount element detection method based on color image segmentation and gradient projection positioning is characterized in that a designed image acquisition system is used to acquire color images; three-color (red, green and blue) images are converted into an HSI color model which is formed by three parameters (H (Hue), S (saturation) and I (Intensity)); as the HSI model directly uses the hue and the saturation having no relation with brightness when the HSI color model extracts the color information, the mount element detection method based on color image segmentation and gradient projection positioning is accurate and highly efficient in segmentation; one the above basis, positioning and detection of elements are carried out; positioning mainly uses the color and geometrical characteristics, and a positioning method based on gradient projection and a principal component characteristic value detection method are proposed; and the mount element detection method based oncolor image segmentation and gradient projection positioning has the advantages of high positioning accuracy and efficiency and accurate detection.

Description

technical field [0001] The invention relates to the technical field of mounting component detection, and more specifically, to a mounting component detection method based on color image segmentation and gradient projection positioning. Background technique [0002] Electronic products are widely used in various fields of industry. Surface mount electronic components are the core components of electronic products, and their functions directly affect the performance of electronic products. At present, electronic components are mainly mounted on circuit boards of electronic products by means of surface mount technology through soldering. Therefore, the quality inspection of solder joints is very critical. Common types of solder joint defects are false soldering, insufficient solder, component offset, wrong parts, and tombstoning. Traditionally, the quality of solder joints is detected by manual visual inspection. However, as the size of electronic components becomes smaller an...

Claims

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Application Information

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IPC IPC(8): G06T7/10G06T7/73
CPCG06T7/10G06T7/73G06T2207/10024G06T2207/20081G06T2207/30148
Inventor 吴浩欧阳柯姚战鳌
Owner ANHUI UNIVERSITY OF TECHNOLOGY
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