Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Semiconductor laser beam combiner and beam combining method

一种激光器、半导体的技术,应用在半导体激光器装置、半导体激光器、激光器装置等方向,能够解决未能超越等问题,达到实现光束质量的效果

Inactive Publication Date: 2018-04-20
CHANGCHUN INST OF OPTICS FINE MECHANICS & PHYSICS CHINESE ACAD OF SCI
View PDF4 Cites 12 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Among them, coherent beam combining and spectral beam combining have obvious advantages in improving the beam quality, but they have not surpassed the beam quality of a single tube. In the traditional method involving external cavity beam combining, the output coupling mirror is an indispensable one. device, however, the beam combining system will ultimately not exceed the beam quality of the single device

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Semiconductor laser beam combiner and beam combining method
  • Semiconductor laser beam combiner and beam combining method
  • Semiconductor laser beam combiner and beam combining method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0032] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.

[0033] In order to make the above objectives, features and advantages of the present invention more obvious and understandable, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0034] reference figure 1 , figure 1 It is a schematic structural diagram of a semiconductor laser beam combining device provided by an embodiment of the present invention.

[0035]...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present invention discloses a semiconductor laser beam combiner and a beam combining method. The beam combiner comprises: a semiconductor laser set, a fast-axis collimation lens set, a slow-axis collimation lens set, a fast-axis and slow-axis switching device, a Fourier transform lens, an optical grating and a reflector. The semiconductor laser set is configured to emit a beam set with the same direction; the fast-axis collimation lens set is configured to reduce a fast-axis direction divergence angle of the beam set; the slow-axis collimation lens set is configured to reduce a slow-axis direction divergence angle of the beam set; the fast-axis and slow-axis switching device is configured to switch a fast-axis direction and a slow-axis direction of the beam set; the Fourier transform lens is configured to perform Fourier transform of the beam set and perform focusing of the beam set; the optical grating is configured to perform diffraction of the focused light; and the reflector isconfigured to receive light after diffraction and perform feedback of part of the light to the optical grating so as to perform feedback of the part of the light to the rear cavity surface of a semiconductor laser to achieve stable outer cavity locking and allow the other part of the light to perform enhancement output. Light beam quality better than a single tube is achieved.

Description

Technical field [0001] The present invention relates to the technical field of semiconductor lasers, and more specifically, to a beam combining device and a beam combining method of a semiconductor laser. Background technique [0002] With the continuous development of science and technology, semiconductor lasers have been widely used in people's daily life and work, bringing great convenience to people's lives. [0003] Semiconductor lasers have significant advantages in terms of efficiency, volume, lifespan, and integration. They have great application prospects in industrial and military fields. However, semiconductor lasers often have problems such as high power, large divergence angle and poor beam quality, which cannot satisfy civilian use. , Industry, military and other fields. [0004] There are many existing beam combining methods for semiconductor lasers, such as spatial combining, waveguide combining, spectral combining, coherent combining, and polarization combining. Am...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01S5/00H01S5/40G02B27/09
CPCG02B27/0977H01S5/0071H01S5/4012H01S5/4075H01S3/0818H01S5/0287H01S5/148H01S5/4062H01S5/143H01S3/08086H01S5/4025H01S3/06758H01S3/08009H01S5/1096H01S3/2383H01S5/5027H01S3/067
Inventor 佟存柱孙方圆赵宇飞舒世立汪丽杰侯冠宇田思聪王立军
Owner CHANGCHUN INST OF OPTICS FINE MECHANICS & PHYSICS CHINESE ACAD OF SCI
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products