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Silicon wafer wet-etching device

A silicon wafer and wet etching technology, which is applied in the field of silicon wafer wet etching equipment, can solve problems such as the inability to realize automatic addition of chemical reagents at all times, and achieve the effect of easy dehydration and stable control

Inactive Publication Date: 2018-04-24
LESHAN TOPRAYCELL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the wet etching device of the above-mentioned solar cells cannot realize the automatic addition of chemical reagents at all times.

Method used

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  • Silicon wafer wet-etching device

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Embodiment Construction

[0016] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0017] Such as figure 1 As shown, the silicon wafer wet etching device described in the present invention includes a water storage tank 300, an HF storage tank 200, a HNO 3 The storage box 400 and the PSG removal tank 100, etching tank 101, first cleaning tank 102, alkali cleaning tank 103, acid neutralization tank 104, second cleaning tank 105, pickling tank 106, The third cleaning tank 107;

[0018] The water storage tank 300 communicates with the etching tank 101, the first cleaning tank 102 and the second cleaning tank 105 respectively through a solenoid valve 500 with a flow meter;

[0019] The HF storage tank 200 communicates with the PSG removal tank 100 and the etching tank 101 respectively through a solenoid valve 500 with a flow meter;

[0020] The HNO 3 The storage tank 400 communicates with the etching tank 101 and the pickling tank 106 ...

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Abstract

The invention discloses a silicon wafer wet-etching device capable of automatically adding chemical reagents in a wet-etching process. The silicon wafer wet-etching device comprises a water storage tank, an HF storage tank and an HNO3 storage tank and also comprises a PSG removal tank, an etching tank, a first cleaning tank, an alkaline cleaning tank, an acid neutralization tank, a second cleaningtank, an acid pickling tank and a third cleaning tank which are orderly arranged along a silicon wafer transport direction. The water storage tank communicates with the etching tank, the first cleaning tank and the second cleaning tank through solenoid valves with flow meters. The HF storage tank communicates with the PSG removal tank and the etching tank through solenoid valves with the flow meters. The HNO3 storage tank communicates with the etching tank and the acid pickling tank through solenoid valves with flow meters. By using the silicon wafer wet-etching device, the automatic adding of a corresponding chemical reagent in a corresponding process tank can be realized, the measurement of adding can be ensured, and the proportion of corresponding solutions in the process tank can be ensured.

Description

technical field [0001] The invention relates to the field of wet etching of solar cells, in particular to a silicon wafer wet etching device. Background technique [0002] As we all know, solar photovoltaic power generation has become a major strategic measure to ensure the strategic security of my country's energy supply, significantly reduce emissions and ensure sustainable development due to its significant advantages such as cleanliness, continuous flow, and safety. The use of solar power to generate electricity is inseparable from solar cells, and thus cannot be separated from the important process of producing cells-wet etching. [0003] In the prior art, such as the Chinese invention patent application, application number 201410699196.8 discloses a wet etching method and device for solar cells, the device includes an etching tank, a first cleaning tank, an alkali cleaning tank, and a second cleaning tank placed in sequence Tank, pickling tank and third cleaning tank;...

Claims

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Application Information

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IPC IPC(8): H01L21/67H01L31/18
CPCH01L21/67023H01L21/67075H01L31/18Y02P70/50
Inventor 陈五奎刘强徐文州
Owner LESHAN TOPRAYCELL