Flip chip packaging structure and process, and camera module packaging structure
A packaging structure, flip-chip technology, applied in the direction of electrical components, electrical solid devices, circuits, etc., can solve the problems of easy damage in the process of module assembly, long delivery cycle, sensor damage, etc.
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[0033] The first object of the present invention is to provide a flip-chip packaging structure, the structural design of the flip-chip packaging structure can provide effective support and protection for the sensor, has good reliability, and reduces costs. The second aspect of the present invention One purpose is to provide a flip-chip packaging process based on the above-mentioned flip-chip packaging structure and a camera module packaging structure.
[0034] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0035]...
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