The invention discloses an organosilicon material. The organosilicon material comprises: a component A comprising, by weight, 80-200 parts of organopolysiloxane, 20-60 parts of a reinforcing filler, 0-20 parts of silicon resin, 50-80 parts of a heat conduction filler, 2-20 parts of a structurized control agent, and 0.05-0.8 parts of a reaction catalyst; and a component B comprising, by weight, 80-200 parts of organopolysiloxane, 0.5-10 parts of organic hydrogen-containing polysiloxane, 20-60 parts of the reinforcing filler, 0-20 parts of silicon resin, 50-80 parts of the heat conduction filler, 2-20 parts of the structurized control agent, and 0.05-0.4 parts of a reaction inhibitor, wherein a weight ratio of the component A to the component B is 1:1. The invention also discloses a preparation method of the organosilicon material, and a method for applying the organosilicon material in 3D printing. The organosilicon material has the advantages of superior performances, safety and non-toxicity; the preparation method of the organosilicon material is simple and is easy to carry out; and application of the organosilicon material in 3D printing is maneuverable.