LED device with high luminous efficiency, LED device packaging device and LED packaging method

Abstract

The invention provides a packaging device for a LED device with high luminous efficiency, which comprises a first electrical connecting sheet, a second electrical connecting sheet, a reflector cup, aninsulation dam and a dispensing die for injecting fluorescent glue into the reflector cup. The insulation dam is arranged between the first electrical connecting sheet and the second electrical connecting sheet; the reflector cup is arranged on the first electrical connecting sheet and the second electrical connecting sheet; the first electrical connecting sheet is provided with a LED placement region; the LED placement region is positioned in the reflector cup; the dispensing die is positioned above the reflector cup; a die cavity of the dispensing die is opposite to the reflector cup; the inner wall of the dispensing die, which is opposite to the reflector cup, is provided with a bumpy pattern; an accommodating cavity contained with the fluorescent glue is also formed on the upper surface of the dispensing die; and the dispensing die is also provided with a through hole for communicating the accommodating cavity with the reflector cup. According to the packaging device for the LED device with high luminous efficiency, which is provided by the invention, a LED product packaged by the packaging device is high in luminous efficiency and high in product yield.

Description

technical field [0001] The invention relates to an LED device with high light extraction efficiency, an LED packaging device and an LED packaging method, and belongs to the technical field of LEDs. Background technique [0002] Light-emitting diode, referred to as LED, is called the fourth generation of new light source or green light source. Because of its energy saving, environmental protection, energy saving, long life, small size and many other advantages, it is widely used in indication, display, decoration, backlight, general lighting and Urban night scenes and other fields. [0003] In recent years, with the breakthrough of materials and technologies, the application range of light-emitting diodes has been gradually expanded and its performance requirements have become higher and higher. For example, the demand for low color temperature phosphor-converted yellow LEDs and LED products with higher light efficiency more and more. New challenges and high performance req...

AI Technical Summary

Problems solved by technology

However, the high-concentration fluorescent glue corresponding to the large particle size will have a series of problems in the actual packaging process, such as abnormal glue dispensing, easy to block the dispensing cavity, short dispensing operation time, low efficiency, and reduced yield.

At present, the main solutions to these problems are: increasing the depth of the bracket bowl and thinning the thickness of the chip, and correspondingly increasing the depth of the bracket bowl requires a new mold, which increases the production cost, and thinning the chip thickness will greatly reduce the product quality. Brightness, can not achieve the purpose of improving light efficiency

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