Air-tightness LTCC substrate and through-wall micro-strip structure
A technology of airtightness and substrate, applied in the direction of electrical components, electric solid devices, circuits, etc., can solve the problems of product scrapping and unqualified leakage rate, and achieve the effect of reducing leakage channels and leakage rate
Pending Publication Date: 2018-05-04
NO 43 INST OF CHINA ELECTRONICS TECH GRP CETC
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Problems solved by technology
The LTCC substrate with a through-wall structure will often be scrapped due to unqualified leakage rate during the integrated packaging. How to solve the hermetic packaging of this LTCC substrate with a special structure is whether it can be applied to high-reliability The key to aerospace products
Method used
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Embodiment Construction
[0016] The present invention will be further described below in conjunction with accompanying drawing:
[0017] Such as figure 1 As shown, the airtight LTCC substrate of the present embodiment is made by stacking and sintering multi-layer ceramic substrates. The ceramic substrate includes an upper layer of green ceramic tape 11 and a lower layer of green ceramic tape 12, and the upper layer of green ceramic tape 11 is provided along its lower surface. Outwardly extending first connecting portion 13, the lower green ceramic belt 12 is provided with a second connecting portion 14 corresponding to the first connecting portion 13 along its upper surface, the first connecting portion 13 is connected to the second connecting portion 14, and the upper layer A metal grounding layer 15 is provided between the green ceramic tape 11 and the lower layer of the green ceramic tape 12 , and an opening 16 is provided on the metal grounding layer 15 . Both the upper green ceramic belt 11 and ...
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The invention relates to an air-tightness LTCC substrate and a through-wall micro-strip structure. The air-tightness LTCC substrate comprises an upper green tape and a lower green tape, wherein a first connecting part extending outwards is arranged along the lower surface of the first green tape, a second connecting part corresponding to the first connecting part is arranged along the upper surface of the lower green tape, the first connecting part and the second connecting part are connected, metal grounding layers are arranged between the upper green tape and the lower green tape, holes areformed in the metal grounding layers, and the upper green tape and the lower green tape are closely connected through pressing and sintering via the holes. According to the air-tightness LTCC substrate and the through-wall micro-strip structure, compact connection is formed between the upper green tape and the lower green tape in the sintering process by reducing the contact area of grounding metal with white porcelain, accordingly, continuity of the grounding metal signal function is not affected, the upper layer and the lower layer can be sintered compactly through material design, gas leakage channels are reduced, and the leakage rate of the substrate is reduced.
Description
technical field [0001] The invention relates to a substrate, in particular to an airtight LTCC substrate and a through-wall microstrip structure. Background technique [0002] The LTCC substrate provides a reliable solution for the miniaturization of T / R component modules. Through multi-layer wiring and embedded components, the volume of components can be greatly reduced, and the low dielectric loss of LTCC ensures the high-frequency signal transmission of T / R components. s efficiency. In addition, the LTCC multi-layer substrate is directly welded to the Kovar frame and the base, so that the multi-layer substrate can be used not only as a multi-layer circuit interconnection substrate, but also as the base of the packaging shell, so as to realize the integrated airtight packaging of the LTCC substrate and the shell. Such as figure 1 shown. The purpose of hermetic packaging is to isolate the environment and prevent the erosion of liquid, solid or gaseous pollutants. Especia...
Claims
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Login to View More IPC IPC(8): H01L23/14H01L23/538
CPCH01L23/5385H01L23/142
Inventor 吕洋董兆文沐方清李建辉项玮马涛王岩吴建利
Owner NO 43 INST OF CHINA ELECTRONICS TECH GRP CETC