Improved TO-220EW lead frame

A TO-220EW, lead frame technology, applied in the field of semiconductor packaging, can solve the problems of enterprise loss, poor insulation effect, poor plastic sealing effect, etc.

Active Publication Date: 2018-05-04
TAIZHOU YOURUN ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The structure of the existing lead frames on the market often has problems such as poor plastic sealing effect, poor insulation effect, and poor waterproof effect, and it is difficu

Method used

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  • Improved TO-220EW lead frame
  • Improved TO-220EW lead frame
  • Improved TO-220EW lead frame

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Experimental program
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Effect test

Embodiment 1

[0020] Embodiment 1: An improved TO-220EW lead frame, including several frame units connected in series by connecting ribs 1, each frame unit includes a base body 2 and a pin area 3, and the base body 2 includes a heat sink area 21 and the carrier area 22, the thickness direction of the substrate 2 is provided with a reverse flow slope 4, and the included angle of the reverse flow slope 4 is 60°; both sides of the heat sink area 21 are provided with a trapezoidal notch 211, and the inner surface of the trapezoidal notch 211 has a tapered blind hole; the chip loading area 22 is provided with a chip mounting groove, and chip fixing structures 5 are arranged on both sides of the chip mounting groove; A baffle that can be inserted movably in the interior; waterproof structures 6 are provided on both sides of the loading area 22; The water guide channel 62, the water guide channel 62 is an open horn-shaped structure; the pin area 3 is provided with three pins, the top of the middle...

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PUM

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Abstract

The invention discloses an improved TO-220EW lead frame. The frame comprises multiple frame units which are in series connection through connection ribs in sequence, each frame unit comprises a substrate and a pin area, and the substrates comprise heat dissipation sheet areas and slide glass areas; the slide glass areas are provided with chip installation slots, the pins areas are provided with multiple pins, and connection sheets are arranged at the tops of the middle pins; welding areas are arranged on the tops of the other pins, the pin areas are connected with the substrates through the connection sheets, and heat dissipation holes are formed in the heat dissipation sheet areas; first kidney-shaped holes are formed in the junctions of the heat dissipation sheet areas and the slide glass areas, first buffer slots are formed in the lower portions of the first kidney-shaped holes, second kidney-shaped holes are formed in the lower portions of the welding areas, and second buffer slotsare formed in the lower portions of the second kidney-shaped holes; protuberant pin protrusions are arranged on outer lead areas of all the pins, and pin mouths are arranged on the bottoms of the pins. The improved TO-220EW lead frame of the structure is excellent in insulation performance and high pressure resistance and good in waterproof effect and product performance and has high market competitiveness.

Description

technical field [0001] The invention belongs to the technical field of semiconductor packaging, and in particular relates to an improved TO-220EW lead frame. Background technique [0002] As the chip carrier of the integrated circuit, the lead frame is a key structural part that realizes the electrical connection between the lead-out end of the chip's internal circuit and the external lead by means of a bonding material, forming an electrical circuit. It acts as a bridge connecting the external wire. Most of the semiconductor integrated blocks need to use lead frames, which are important basic materials in the electronic information industry. The structure of the existing lead frames on the market often has problems such as poor plastic sealing effect, poor insulation effect, and poor waterproof effect, and it is difficult to remove the mold during processing, resulting in poor product quality; it is often caused by vibration during installation. Chip fragmentation, causing...

Claims

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Application Information

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IPC IPC(8): H01L23/495
CPCH01L23/495H01L23/49565H01L23/49568H01L2224/16225
Inventor 张轩
Owner TAIZHOU YOURUN ELECTRONICS
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