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Infrared large-area-array multi-module automatic splicing mechanism

An automatic splicing, multi-module technology, applied in measurement devices, instruments, scientific instruments, etc., can solve the problems of high requirements for glue material coating process, scrapped focal plane of splicing, and high risk, and achieves high maintainability, low stress, good repeatability

Active Publication Date: 2018-05-08
SHANGHAI INST OF TECHNICAL PHYSICS - CHINESE ACAD OF SCI
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Its advantage is that it can achieve very high-precision plane splicing; its difficulty lies in the selection of glue materials, the control of the repeat height of the suction cup, and the high requirements for the glue coating process; the disadvantage is that the risk is high, and the focal plane cannot be replaced once it is glued. Damage to one focal plane module will result in the scrapping of the entire spliced ​​focal plane

Method used

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  • Infrared large-area-array multi-module automatic splicing mechanism
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  • Infrared large-area-array multi-module automatic splicing mechanism

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Embodiment Construction

[0065] Below in conjunction with accompanying drawing and embodiment the specific embodiment of the present invention is described in further detail:

[0066] This embodiment is a large area array infrared detector for an aerospace pre-research project, which consists of four short-wave 1K×1K large-scale detector modules 1 spliced ​​with high precision, and its mounting surface size is 22.1mm×28.3mm. required to follow figure 2 Splicing is carried out in the form of SiC / Al mounting substrate 201, and the centers of the modules are arranged in parallel to form a square. The three-dimensional spatial position relationship of the large area array detector module 1 is: the distance between the centers of the photosensitive surfaces satisfies 22.530mm±0.005mm in the X direction and 28.40mm in the Y direction. mm±0.005mm, the height difference in the Z direction between the photosensitive surfaces of the major area array detector modules 1 is ≤0.005mm, and the deviation between the...

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Abstract

The invention discloses an infrared large-area-array multi-module automatic splicing mechanism. The infrared large-area-array multi-module automatic splicing mechanism is formed by a focal plane splicing substrate, a large-area-array detector module, a large-area-array infrared detector splicing mechanism, a fine-tuning piezoelectric stepping motor and a fine-tuning piezoelectric rotation motor. The mechanism is characterized by firstly, positioning and punching the focal plane splicing substrate and coating a low temperature glue; installing a plurality of area-array detectors on the substrate; using an infrared focal-plane large-area-array multi-module centering splicing mechanism to realize horizontal plane and Z shaft height direction high precision adjusting; then, carrying out normaltemperature solidification on the splicing substrate and a plurality of infrared detector modules; and finally, separating the infrared focal-plane multi-module centering splicing mechanism from thefine-tuning stepping and rotation motors with a large-area-array infrared detector so that three-dimensional splicing of the multi-module large-area-array infrared detector is completed. In the invention, high-precision automatic centering splicing among the plurality of detector modules can be realized, precision is high and repeatability is good, simultaneously, a large scale area array module can be individually replaced and maintainability is good.

Description

technical field [0001] The present invention relates to the splicing technology of multi-module infrared detectors, and specifically refers to an infrared large area array multi-module automatic splicing mechanism, which is suitable for assembly of large area array infrared focal plane detector components, and is also suitable for multi-module CCD focal plane detectors Assembly of components. Background technique [0002] Two important performance indicators of infrared remote sensing instruments are field of view and spatial resolution. Two important performance indicators of infrared remote sensing instruments are field of view and spatial resolution. The expansion of the field of view can increase the observation range of the instrument, and the improvement of the spatial resolution can improve the imaging quality of the instrument. In an infrared imaging system, the focal length of the optical system and the size of the detector determine the field of view of the syste...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01J5/02
CPCG01J5/022Y02P70/50
Inventor 杨力怡曾智江莫德锋郝振贻王小坤
Owner SHANGHAI INST OF TECHNICAL PHYSICS - CHINESE ACAD OF SCI
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