A power semiconductor module welding device

A technology for power semiconductors and welding devices, which is applied to semiconductor devices, semiconductor/solid-state device components, electric solid-state devices, etc., can solve the problems of difficult expansion of welding devices, difficulty in releasing welding stress, and low welding quality, etc., and achieve extended use. Strong performance, avoid stress accumulation, simple structure effect

Active Publication Date: 2020-06-26
ZHUZHOU CRRC TIMES SEMICON CO LTD
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  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] In view of this, the object of the present invention is to provide a power semiconductor module welding device, which solves the problems of complicated power terminal welding tooling in the existing power semiconductor module packaging process, difficulty in releasing welding stress, poor welding quality and difficulty in expanding the use of the welding device. question

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  • A power semiconductor module welding device
  • A power semiconductor module welding device
  • A power semiconductor module welding device

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Embodiment Construction

[0027] In order to make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be described clearly and completely in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.

[0028] As attached figure 1 Attached image 3 As shown, a specific embodiment of the welding device for a power semiconductor module of the present invention is given, and the present invention will be further described below with reference to the drawings and specific embodiments.

[0029] As attached figure 1 And figure 2...

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Abstract

The invention discloses a power semiconductor module welding device, comprising: a substrate assembly, a fixed plate, an elastic crimping piece and a power terminal, the substrate assembly includes a bottom plate, and an insulating piece arranged on the bottom plate, and a semiconductor chip and an insulating piece are arranged on the insulating piece welded part. The fixed plate is fixed on the substrate assembly through elastic crimping parts, and a space for accommodating power terminals is formed between the fixed plate and the substrate assembly. The power terminal passes through the fixed plate and abuts against the upper bottom of the fixed plate. The pins at the end of the power terminal contact the welding part under the positioning of the fixed plate, and the power terminal is fixed and welded through the elastic crimping piece. In-process pressure regulation. The invention can solve the technical problems of complicated welding tooling for power terminals in the existing power semiconductor module packaging process, difficulty in releasing welding stress, resulting in low welding quality and difficulty in expanding the use of welding devices.

Description

Technical field [0001] The present invention relates to the field of power electronic device manufacturing, in particular to a welding device with pressure regulating function applied to power semiconductor modules. Background technique [0002] At present, the packaging process of power semiconductor modules, such as IGBT (Insulated Gate Bipolar Transistor) modules, usually involves multiple soldering. The welding of the power terminal and the substrate assembly is usually the last welding, and it is also the most critical step in the entire packaging process, because the welding quality is directly related to the service life and reliability of the module. At present, although advanced power semiconductor module packaging technology can achieve accurate positioning and welding operations for a small number of power terminals and substrate components, with the substantial increase in power density, high-power semiconductor modules face high integration design requirements. Take...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/32H01L25/07
CPCH01L25/072H01L23/32
Inventor 袁勇黄南陈燕平熊辉时海定文驰孙康康高海祐
Owner ZHUZHOU CRRC TIMES SEMICON CO LTD
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