Semiconductor process water heat preservation system
A technology of thermal insulation system and process water, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as very large impact, reduced production capacity, and impact on operation efficiency, achieving a simple overall structure, saving water resources, and cost. low cost effect
Active Publication Date: 2018-05-25
SHENYANG KINGSEMI CO LTD
View PDF8 Cites 2 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0002] The temperature of the process water is very important in the semiconductor industry. It has a great impact on the production capacity, consistency, and pass rate of the product. Reduced, the products produced cannot meet the qualified requirements, and in the prior art, in order to keep the temperature of the process water constant when it flows to the working area, it is necessary to adjust the temperature of the process water several times, which seriously affects the operating efficiency, and the qualified rate of the product is also low. not fully guaranteed
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0021] The present invention will be described in further detail below in conjunction with the accompanying drawings.
[0022] Such as figure 1 As shown, the present invention includes a heat exchanger 3, a heat exchange device 6, a heat exchange block 8, a medicine valve assembly 9, an output end block 10 and a double-layer insulation sleeve 18, wherein the heat exchange device 6, the heat exchange block 8 , the medicine valve assembly 9 and the output end block 10 are provided with mutually independent insulation water passages and process water passages, and the insulation water passages in the various components are connected in sequence, and the process water passages in the various components are connected in sequence, The insulating water outlet port on the heat exchanger 3 is connected to the inlet of the insulating water channel in the heat exchange device 6 through the insulating water inlet pipeline 4, and the heat exchange block 8 and the medicine valve assembly 9 ...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention relates to the field of semiconductor production, and particularly relates to a semiconductor process water heat preservation system. The semiconductor process water heat preservation system is characterized in that a heat exchange device, a heat exchange block, a drug valve assembly and an output end block are provided with a heat preservation water channel and a process water channel, the heat preservation water channels in the components are sequentially communicated, the process water channels in the components are sequentially communicated, the heat exchange block, the drugvalve assembly and the output end block are sequentially connected through a double-layer heat preservation sleeve, the double-layer heat preservation sleeve is internally provided with an inner flowchannel and an outer flow channel, the process water channels in the heat exchange block, the drug valve assembly and the output end block are sequentially communicated through the inner flow channel,the heat preservation water channels in the heat exchange block, the drug valve assembly and the output end block are sequentially communicated through the outer flow channel, a heat preservation water outlet port on the heat exchange device is connected with an inlet of the heat preservation water channel in the heat exchange device, and an outlet of the heat preservation water channel in the output end block is connected with a heat preservation water return port on the heat exchange device. The temperature uniformity of process water can be ensured according to the invention.
Description
technical field [0001] The invention relates to the field of semiconductor production, in particular to a semiconductor process water heat preservation system. Background technique [0002] The temperature of process water is very important in the semiconductor industry. It has a great impact on the production capacity, consistency, and pass rate of products. Reduced, the products produced cannot meet the qualified requirements, and in the prior art, in order to keep the temperature of the process water constant when it flows to the working area, it is necessary to adjust the temperature of the process water several times, which seriously affects the operation efficiency, and the product qualification rate is also low. Not guaranteed. Contents of the invention [0003] The object of the present invention is to provide a heat preservation system for semiconductor process water, which can minimize the distance of process water without heat preservation during the whole heat...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67
CPCH01L21/67017
Inventor 郭聪张怀东
Owner SHENYANG KINGSEMI CO LTD