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A kind of low-temperature heat-sealing dispersion liquid and preparation method thereof

A low-temperature heat-sealing and dispersion technology, applied in the direction of coating, etc., can solve the problems of increased scrap rate, low heat-sealing temperature, and inability to fully meet the packaging needs of first-use

Active Publication Date: 2020-03-20
HAINAN BNK WATER BASED NEW MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The low-temperature heat-sealing acrylic involved in the patent CN 103059213 A, because the heat-sealing temperature is too low, the rolled film tends to be sticky during use, resulting in an increase in the reject rate
The low-temperature heat-sealable acrylic emulsion involved in CN 102850891A has a sealing temperature of 80°C, which cannot fully meet the packaging requirements for prior use

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] 25% sarin resin

[0019] 2% acrylic resin

[0020] 1.4% compound emulsifier

[0021] 0.1% defoamer

[0022] 1.5% pH regulator

[0023] 70% deionized water.

[0024] 1) Configuration of compound emulsifier

[0025] Weigh 2.1g of propylene glycol monolaurate and 0.7g of alkyl sulfate compound emulsifier and mix with 14g of deionized water, heat to 50°C, stir while heating at a stirring speed of 70 rpm, stir for 1h, and set aside .

[0026] 2) Preparation of dispersion

[0027] Add 126g of deionized water, 50g of sarin resin and 4g of acrylic resin into the reaction kettle, stir at a stirring speed of 200 rpm, add the prepared compound emulsifier, and replace it by vacuuming→adding nitrogen for 3 Finally, fill in nitrogen to make the pressure in the kettle reach 1Mpa, adjust the stirring speed to 2000 rpm, heat to 90°C, keep the temperature at a constant temperature for 3 hours, add 0.2g defoamer and 3g pH regulator again, stir fully, and the stirring speed is 100 ...

Embodiment 2

[0030] 24% sarin resin

[0031] 2% acrylic resin

[0032] 1% compound emulsifier

[0033] 0.2% defoamer

[0034] 1.5% pH regulator

[0035] 71.3% deionized water.

[0036] 1) Configuration of compound emulsifier

[0037] Weigh 2.4g of propylene glycol monolaurate and 0.6g of alkyl sulfate compound emulsifier and mix with 21.4g of deionized water, heat to 52°C, stir while heating, the stirring speed is 80 rpm, stir for 1h, wait use.

[0038] 2) Preparation of dispersion

[0039] Add 192.5g of deionized water, 72g of sarin resin and 6g of acrylic resin into the reaction kettle, stir at a stirring speed of 300 rpm, add the prepared compound emulsifier, and replace by vacuuming→adding nitrogen 3 times, finally fill in nitrogen to make the pressure inside the kettle reach 1Mpa, adjust the stirring speed to 2000 rpm, heat to 91°C, keep the temperature constant for 4 hours, add 0.6g defoamer, 4.5g pH regulator again, stir fully, stir The speed is 110 rpm, and after cooling do...

Embodiment 3

[0042] 22% sarin resin

[0043] 3% acrylic resin

[0044] 3% compound emulsifier

[0045] 0.1% defoamer

[0046] 1.5% pH regulator

[0047] 70.4% deionized water.

[0048] 1) Configuration of compound emulsifier

[0049] Weigh 18g of propylene glycol monolaurate, 6g of alkyl sulfate compound emulsifier and 56.3g of deionized water and mix them, heat to 51°C, stir while heating at a stirring speed of 90 rpm, stir for 1h, and set aside.

[0050] 2) Preparation of dispersion

[0051] Add 506.9g of deionized water, 176g of sarin resin and 24g of acrylic resin into the reaction kettle, stir at a stirring speed of 300 rpm, add the prepared compound emulsifier, and replace by vacuuming→adding nitrogen 3 times, and finally filled with nitrogen to make the pressure in the kettle reach 1Mpa, adjust the stirring speed to 2000 rpm, heat to 92°C, keep the temperature for 4 hours, add 0.8g defoamer, 12g pH regulator again, stir fully, the stirring speed 120 rev / min, after cooling dow...

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Abstract

A low-temperature heat-sealing dispersing solution is prepared from the following raw materials by weight: 20%-25% of Surlyn resin, 2%-5% of acrylic resin, 1%-3% of a compound emulsifier, 0.1%-0.2% ofa defoaming agent, 0.5%-1.5% of a pH regulator, and 70%-75% of deionized water. The dispersing solution greatly improves the dispersion effect through the compound emulsifier; after a BOPP thin filmis coated with the dispersing solution, the dispersing solution has good adhesion and excellent low-temperature heat-sealing properties; when the heat-sealing temperature is 70 DEG C, the heat-sealingstrength is more than or equal to 1.0 N / 15 mm; and when the heat-sealing temperature is 127 DEG C, the heat-sealing strength is more than or equal to 2.5 N / 15 mm.

Description

technical field [0001] The invention relates to a low-temperature heat-sealing dispersion liquid and a preparation method thereof, belonging to the field of novel environment-friendly polymer materials. Background technique [0002] Today, with the accelerated pace of life or work, foods such as candy and chocolate need high-speed packaging, but the current packaging materials have poor low-temperature heat-sealing performance, and the sealing temperature is high, requiring more than 100°C, which cannot meet the current high-speed packaging requirements. need. Patent CN101358054 discloses low-temperature heat-sealed high-barrier food packaging coating film latex and its preparation method. The monomers used in the latex include vinylidene chloride accounting for 80-93% of the total amount of mixed monomers, methyl acrylate, ethyl ester, methyl acrylate Methyl acrylate, butyl, acrylonitrile or methacrylonitrile account for 2-10% of the total amount of mixed monomers, and ita...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09D123/08C09D133/04C09D7/63C08J7/04C08L23/12
CPCC08J7/0427C08J2323/12C08J2423/08C09D123/0876C08L33/04C08K5/103C08K5/41
Inventor 黄宏存朱海
Owner HAINAN BNK WATER BASED NEW MATERIAL CO LTD
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