Cutter for cutting wafers and wafer cutting method
A cutting method and wafer technology, applied in the direction of manufacturing tools, fine working devices, stone processing equipment, etc., can solve problems such as wafer cracking and product failure, and achieve the effect of reducing stress concentration and cracks
Inactive Publication Date: 2018-06-01
HUAIAN IMAGING DEVICE MFGR CORP
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- Abstract
- Description
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Problems solved by technology
[0004] The problem that the present invention solves is that the process of cutting the edge of the wafer by the cutting tool of the prior art may cause the wafer to crack at its edge, resulting in defective products
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[0027] In the process of cutting the edge of the wafer with a cutting tool, the cause of the cracking of the wafer is that the part of the cutting tool used for cutting the wafer in the prior art generally has a relatively sharp corner. Stress concentrations occur at the corners, creating cracks that cause the wafer to break.
[0028] In order to make the above objects, features and advantages of the present invention more comprehensible, specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.
[0029] refer to figure 1 , figure 2 , a tool 100 for wafer cutting, including a cutter head 10 and a cutter shaft 20, the cutter shaft 20 is fixedly connected to the cutter head 10, and is located on the central axis of the cutter head 10, and the cutter shaft 20 can rotate to drive the cutter head 10 to rotate. The cutter head 10 has an outer peripheral surface 11 and a first surface 12 and a second surface 13 ...
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Abstract
The invention discloses a cutter for cutting wafers and a wafer cutting method. The cutter comprises a cutter shaft and a cutter disc. The cutter disc is fixedly arranged at one end of the cutter shaft. The cutter shaft is located on the central axis of the cutter disc and is suitable for driving the cutter disc to rotate so that the wafers can be cut. The cutter disc is provided with a first surface where the cutter shaft is arranged, a second surface back on to the cutter shaft, and an outer circumferential surface. The outer circumferential surface is perpendicular to the second surface. The cutter disc is further provided with a curved surface which is located between the outer circumferential surface and the second surface and surrounds the cutter shaft. The two axial ends of the curved surface are connected with the outer circumferential surface and the second surface correspondingly. The included angle alpha between the curved surface and the outer circumferential surface and the included angle beta between the curved surface and the second surface meet the requirements that alpha is greater than 90 degrees and less than or equal to 180 degrees, and beta is greater than 90 degrees and less than or equal to 180 degrees. Thus, the sharp corner between the outer circumferential surface and the second surface can be rounded and becomes smooth. In the wafer cutting process through the cutter, stress concentration at the sharp corner position can be reduced, and the risks of cracks and brakeage of the wafers are reduced.
Description
technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a cutting tool for wafer cutting and a wafer cutting method. Background technique [0002] In the field of semiconductor manufacturing technology, sometimes it is necessary to make the wafer have a very thin thickness, for example, 50 microns or even less. At this time, the wafer needs to be ground to reduce the thickness of the wafer. During the wafer manufacturing process, the stress is usually concentrated on the edge of the wafer. If the wafer is directly ground, cracks will occur at the edge of the wafer, resulting in defective products. [0003] In the prior art, in order to prevent the wafer from cracking at its edge, before the wafer is ground, the front side of the wafer is usually cut with a tool to cut off the edge portion where the stress concentration is located on the front side of the wafer, and then The backside of the wafer is ground to redu...
Claims
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IPC IPC(8): B28D5/02
CPCB28D5/022
Inventor 吕新强吴孝哲林宗贤吴龙江郭松辉王海宽
Owner HUAIAN IMAGING DEVICE MFGR CORP