Slice-type temperature sensor and preparation method therefor

Abstract

The invention relates to a slice-type temperature sensor, and the temperature sensor comprises a substrate film, a thermistor chip, a positive circuit layer, a negative circuit layer and a capping film, wherein the substrate film is provided with a chip slot, and the thermistor chip is disposed in the chip slot. The positive circuit layer and the negative circuit layer are disposed on the substrate film and are not in contact with each other, and are respectively connected with positive and negative electrodes of the thermistor chip. The capping film is attached to the substrate film, therebyenabling the thermistor chip, the positive circuit layer and the negative circuit layer to be packaged. The invention also relates to a preparation method for a thermistor with a substrate. The temperature sensor provided by the invention is good in sealing performance, is reliable in performances, is high in protection strength, is resistant to mechanical impact, is resistant to bending, is not liable to be damaged, is long in service life, and is easy to prepare.

Description

technical field [0001] The invention belongs to the technical field of electronic components, and in particular relates to a sheet-type temperature sensor and a preparation method thereof. Background technique [0002] NTC thermistor is a semiconductor resistor that is extremely sensitive to temperature. It has the advantages of high reliability, good stability, flexible use, and long service life. The sheet type NTC thermistor is especially suitable for space temperature detection in narrow areas due to its thin thickness and good elasticity, such as CPU temperature detection of computer mainframes, home appliances, and hand warmers. [0003] Such as figure 1 with figure 2 As shown, the existing film-type NTC thermistor comprises an NTC resistance chip 11, two metal leads 12 and two insulating films 13, and the two insulating films 13 are mutually pasted to make the NTC resistance chip 11 and the two metal leads 12 When packaged, one end of the two metal leads 12 is res...

AI Technical Summary

Problems solved by technology

[0005] One is poor sealing, such as image 3 As shown, due to the influence of the shape of the metal lead wire 12, the two insulating films 13 cannot be pasted completely flat and consistent, and there is a gap 130 that leads to moisture intrusion, so the performance reliability of the product is poor, and the use effect is not good.

[0006] Second, the protection strength is poor. The NTC resistance chip 11 has not been packaged and protected by any higher-strength material after welding. The strength of the insulating film 13 alone cannot withstand external mechanical impact and bending, so it is extremely easy to be damaged, resulting in product reliability. reduced, short service life

Images