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Laser machining system and method

A technology of laser processing and processing methods, applied in laser welding equipment, metal processing equipment, manufacturing tools, etc., can solve the problems of different focus energy and poor laser processing quality, and achieve the effect of improving processing quality and processing efficiency

Pending Publication Date: 2018-06-05
SHENZHEN MICROMACH TECH CO LTD
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Problems solved by technology

[0006] The purpose of the present invention is to overcome the shortcomings of the above-mentioned prior art, and provide a multi-laser processing system and method, aiming at solving the problem that the incident beams are not ideal due to the use of a diffraction beam splitting element to distribute a column of focal points along the central axis in the existing laser processing system. The beam of light, resulting in different focus energy distribution along the central axis, which in turn leads to poor laser processing quality technical problems

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Embodiment Construction

[0022] In order to make the technical problems, technical solutions and beneficial effects solved by the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, and are not used to limit the present invention.

[0023] see figure 1 , figure 1 It is a working principle diagram of the laser processing system provided by an embodiment of the present invention. Such as figure 1 As shown, the laser processing system includes a laser 10, a beam expander 20, a laser mirror 30, a multi-focus generator 40, and a focusing mirror 50 arranged in sequence along the propagation direction of the outgoing beam of the laser 10;

[0024] The beam emitted by the laser 10 enters the beam expander 20, and after being expanded and shaped by the beam expander 20, it is reflected by the...

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Abstract

The invention discloses a laser machining system and method. The laser machining system comprises a laser, a beam expander, a laser reflector, a multi-focus generator and a focus lens, wherein the beam expander, the laser reflector, the multi-focus generator and the focus lens are sequentially arranged in the propagation directions of emergent light beams of the laser; the emergent light beams ofthe laser enters the beam expander, are subjected to beam expanding and shaping through the beam expander and then are reflected into the multi-focus generator through the laser reflector, and the emergent light beams from the multi-focus generator are focused on a to-be-machined object through the focus lens; and the multi-focus generator can change the incident angles forming by the emergent light beams entering the focus lens, so that the laser beams can generate a series of continuous variable focuses through the multi-focus generator, machining is not limited to the surface of the machined object and can reach the interior of the machined object, machining efficiency is improved, and furthermore, the machining quality is improved.

Description

technical field [0001] The invention relates to the technical field of laser processing, in particular to a multi-laser processing system and method. Background technique [0002] Due to the excellent characteristics of laser processing in terms of precision, process flexibility, non-contact processability and thermal influence on materials, the use of laser for material processing is becoming more and more widely used in the entire industry. [0003] The essence of laser processing is to use the high energy density of the focused laser to form an ablation pit on the surface of the material, and then form the processed shape through the auxiliary motion system. In practical applications, it is often necessary to focus the laser beam into a small focus , in order to obtain fine laser processing effect. Since the laser beam is focused into a small focal point, the depth of focus will become very short, and the laser processing is limited to the surface of the material, so tha...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/064B23K26/067
CPCB23K26/064B23K26/0648B23K26/067
Inventor 赵华龙武杰杰
Owner SHENZHEN MICROMACH TECH CO LTD