Degassing chambers and semiconductor processing equipment

Abstract

The invention provides a degassing chamber and semiconductor processing apparatus. The degassing chamber comprises a cavity and a heating device disposed on the upper portion of the cavity, wherein the heating device heats a to-be-processed object placed in the cavity by means of emitted light rays; and the inner side wall and / or the inner bottom wall of the cavity is provided with an anti-reflection structure for reducing or eliminating reflection of light rays by the inner side wall and / or the inner bottom wall of the cavity. The semiconductor processing equipment comprises the degassing chamber. The degassing chamber can reduce or even eliminate the reflection of the light rays emitted from the heating device by the inner side wall and / or the inner bottom wall of the degassing chamber,so that the heating effect on the to-be-processed object caused by heat generated by the reflected light rays is eliminated, and the temperature of the to-be-processed object is no longer reduced as the inner walls of the degassing chamber becomes dirty.

Description

technical field [0001] The invention belongs to the technical field of semiconductor equipment manufacturing, and in particular relates to a degassing chamber and semiconductor processing equipment. Background technique [0002] In the semiconductor equipment integration system, there are mainly three types of modules according to their functions, including degassing process modules, pre-cleaning process modules and deposition process modules. Among them, the degassing process module is the first process module in the whole process flow. It is mainly to degas the workpiece to be processed, so as to remove the impurity gas remaining on the surface or inside of the workpiece S to be processed. These impurity gases cannot appear in the subsequent process chamber. Indoor, otherwise it will affect the performance of semiconductor devices. [0003] In the prior art, the degassing process module bakes and degasses the workpiece through three methods, one is heating with a halogen ...

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Problems solved by technology

[0004] However, there are at least the following problems in the prior art: since the inner wall of the cavity 1 is generally made of metal material, the light emitted by the halogen lamp 4 can pass through the transparent dielectric window 2 to the inner wall of the cavity 1, and the cavity The inner wall of 1 will reflect the light, and the reflected light can also heat the workpiece S to be processed. As the number of pieces of workpiece S to be processed increases, the impurity gas baked out by the degassing process adheres to the surface of chamber 1 The inner wall makes the inner wall of the chamber 1 dirty, causing the reflection of the light on the inner wall of the chamber 1 to be weakened. Therefore, the light reflected by the inner wall of the chamber 1 in multiple processes is not the same (that is, unstable), so It is impossible to make the temperature in the chamber 1 the same during multiple processes. If the same process time is used, the degassing effect of the workpiece S to be processed will be different in multiple processes, thereby affecting the subsequent process quality; if the degassing effect is the same , the process time required for multiple processes is different, which makes the process operation complicated

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