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Electronic device

A technology for electronic equipment and preset functions, applied in electrical components, magnetic field/electric field shielding and other directions, can solve problems such as damage, functional module displacement, falling off, functional module virtual welding, etc., to avoid virtual welding.

Active Publication Date: 2018-06-05
BEIJING XIAOMI MOBILE SOFTWARE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Then, when the staff needs to disassemble the shielding cover for the purpose of detection, maintenance, etc., when the printed circuit board is heated to the melting point of the solder, the solder corresponding to the shielding cover and the functional module will melt, so that the staff can disassemble the shielding cover. It is easy to cause the displacement and falling off of the functional modules, which not only increases the complexity of the operation, but also may cause unexpected situations such as virtual soldering and damage of the functional modules.

Method used

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Embodiment 1

[0042] In one embodiment, when using the structure of the shielding case 3 in the related art, for the arrangement of the heat conduction layer 4, reference can be made to Figure 6 ;in, Figure 6 is a schematic diagram of setting a heat conduction layer according to an exemplary embodiment, such as Figure 6 As shown, before assembling the shielding cover 3, a heat conduction layer 4 is formed on the upper surface of the chip 2, etc. Spread on the upper surface of the chip 2; then cover the shield 3 on the top of the chip 2 to contact the heat conduction layer 4 to realize heat conduction to the chip 2.

Embodiment 2

[0044] When adopting the method in the first embodiment, that is, firstly installing the heat conducting layer 4 and then assembling the shielding cover 3, on the one hand, the structural relationship between the shielding cover 3 and the heat conducting layer 4 needs to be considered when assembling the shielding cover 3, which may affect the performance of the shielding cover 3. assembly efficiency and assembly effect, on the other hand, due to the inevitable existence of certain processing tolerances and assembly tolerances in the shield cover 3 and the chip 2, etc., but when the heat conduction layer 4 is provided, it cannot accurately match the processing tolerances and assembly tolerances, so that The heat conduction layer 4 may not be well attached to the shield 3 due to insufficient thickness, or the heat conduction layer 4 is too thick to affect the installation of the shield 3 .

[0045] Therefore, the present disclosure adjusts the structure of the shielding case 3 s...

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Abstract

The disclosure relates to an electronic device in which a preset function module is electromagnetically shielded by a shield cover, wherein the preset function module is soldered to a printed circuitboard by using solder tin having a first melting point, the shield cover is soldered to the printed circuit board by solder tin having a second melting point, and the first melting point is higher than the second melting point. Through the technical solution of the present disclosure, it is possible to avoid affecting the preset function module under the shield cover when the shield recover is removed.

Description

technical field [0001] The present disclosure relates to the technical field of terminals, and in particular, to an electronic device. Background technique [0002] In related technologies, on the one hand, as users increasingly demand miniaturization and thinning of electronic equipment, the internal space of electronic equipment is getting smaller and smaller; on the other hand, electronic equipment integrates more and more functions. , leading to a tighter assembly between the functional modules in the electronic device, and more consideration needs to be given to the EMC (Electro Magnetic Compatibility) of each functional module. In the related art, each functional module can be isolated by assembling a shielding cover for the functional module, so as to meet predetermined EMC requirements. [0003] However, in consideration of saving material and equipment costs, reducing assembly complexity, etc., when soldering the functional module and the shielding case to the prin...

Claims

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Application Information

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IPC IPC(8): H05K9/00
CPCH05K9/0028
Inventor 韩高才
Owner BEIJING XIAOMI MOBILE SOFTWARE CO LTD