High productivity PECVD tool for wafer processing of semiconductor manufacturing

Abstract

Embodiments of the present disclosure generally relate to a cluster tool for processing semiconductor substrates. In one embodiment, a cluster tool includes a plurality of process chambers connected to a transfer chamber and each process chamber may simultaneously process four or more substrates. In order to reduce cost, each process chamber includes a substrate support for supporting four or moresubstrates, single showerhead disposed over the substrate support, and a single radio frequency power source electrically coupled to the showerhead. The showerhead may include a first surface facingthe substrate support and a second surface opposite the first surface. A plurality of gas passages may be formed in the showerhead extending from the first surface to the second surface. Process uniformity is improved by increasing the density of the gas passages from the center of the showerhead to the edge of the showerhead.

Description

technical field [0001] Embodiments of the disclosure generally relate to cluster tools for processing semiconductor substrates. Background technique [0002] Substrate throughput has always been a challenge in semiconductor processing. Semiconductor substrates continue to need to be efficiently processed if technology is to advance. Cluster tools have been developed as an efficient means for processing multiple substrates simultaneously without interrupting the vacuum. Instead of processing a single substrate and then exposing the substrate to the atmosphere during transfer to another chamber, multiple processing chambers can be connected to a common transfer chamber so that when processing is completed on a substrate in one processing chamber, The substrate is simultaneously removed under vacuum to another processing chamber coupled to the same transfer chamber. [0003] To further increase throughput and reduce costs, each processing chamber may be capable of processing...

AI Technical Summary

Problems solved by technology

However, uniformity can become an issue when processing more than one substrate at a time in the processing chamber

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