Thermosetting resin composition
A resin composition and thermosetting technology, applied in the fields of thermosetting resin compositions, prepregs and laminates for printed circuits, can solve the problems of poor dielectric properties of cured products, application limitations, and no contribution to the Tg of reinforcing materials. Eliminates the effects of poor dielectric properties, high symmetry, and high functionality
Active Publication Date: 2018-06-12
GUANGDONG SHENGYI SCI TECH
View PDF6 Cites 3 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0005] DOPO-HQ is a reactive phosphorus-containing curing agent that can undergo curing reactions with epoxy resins. However, because its active groups are phenolic hydroxyl groups, it will generate secondary hydroxyl groups with high polarity after reacting with epoxy resins, resulting in The dielectric properties of the cured product are poor
Disclosed in CN103965249A is the preparation method and its use of active esters with phosphaphenanthren
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Login to View More PUM
Login to View More Abstract
The invention provides a thermosetting resin composition. The thermosetting resin composition comprises esterified dihydroxyphenyl phosphaphenanthrene, has the advantages of favorable thermal stability, heat and humidity resistance and tenacity, low dielectric constant and dielectric loss angle tangent, low water absorption, excellent halon-free and flame-retardant effect and the like, and also has favorable workability. The invention further provides application of the thermosetting resin composition to resin sheets, resin and metal composite foils, prepregs, laminated boards, metal foil cladlaminated boards and printed circuit boards.
Description
technical field [0001] The invention relates to the technical field of polymer materials, in particular to a thermosetting resin composition, a prepreg using it and a laminated board for printed circuits. Background technique [0002] Traditional printed circuit laminates usually use brominated flame retardants to achieve flame retardancy, especially tetrabromobisphenol A epoxy resin, this brominated epoxy resin has good flame retardancy, but it is in Combustion produces hydrogen bromide gas. In addition, in recent years, carcinogens such as dioxin and dibenzofuran have been detected in the combustion products of electronic and electrical equipment wastes containing halogens such as bromine and chlorine, so the application of brominated epoxy resins is limited. On July 1, 2006, the EU's two environmental protection directives "Directive on Waste Electrical and Electronic Equipment" and "Directive on the Restriction of the Use of Certain Hazardous Substances in Electrical an...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More IPC IPC(8): C08G59/42C08L63/00
CPCC08G59/423C08L63/00C08L2201/02C08L2201/08C08L2201/22C08L2203/20C08G59/42
Inventor 罗成唐国坊张江陵
Owner GUANGDONG SHENGYI SCI TECH
Features
- R&D
- Intellectual Property
- Life Sciences
- Materials
- Tech Scout
Why Patsnap Eureka
- Unparalleled Data Quality
- Higher Quality Content
- 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com



