A kind of halogen-free thermosetting resin composition and its prepreg, laminated board for printed circuit

Abstract

The present invention relates to a halogen-free thermosetting resin composition, a prepreg using it, and a laminate for printed circuits. The halogen-free thermosetting resin composition, based on 100 parts by weight of organic solids, comprises: (A) 16-42 parts by weight of halogen-free epoxy resin; (B) 1.5-4.8 parts by weight of compound with dihydrobenzoxazine ring; (C) 10-28 parts by weight of phosphorus-containing bisphenol curing agent, said phosphorus-containing bisphenol The weight-average molecular weight of phenol is 1000-6500; (D) 30-70 parts by weight of silicon dioxide. The prepreg and printed circuit laminate made of the halogen-free thermosetting resin composition provided by the invention have high glass transition temperature, excellent dielectric properties, low water absorption, high heat resistance and good processability , and can achieve halogen-free flame retardancy, reaching UL94 V‑0.

Description

technical field [0001] The invention relates to a halogen-free thermosetting resin composition, in particular to a prepreg and a printed circuit laminate made of the halogen-free thermosetting resin composition. Background technique [0002] Traditional printed circuit laminates usually use brominated flame retardants to achieve flame retardancy, especially tetrabromobisphenol A epoxy resin, this brominated epoxy resin has good flame retardancy, but it is in Combustion produces hydrogen bromide gas. In addition, in recent years, carcinogens such as dioxin and dibenzofuran have been detected in the combustion products of electronic and electrical equipment wastes containing halogens such as bromine and chlorine, so the application of brominated epoxy resins is limited. On July 1, 2006, the EU's two environmental protection directives "Directive on Waste Electrical and Electronic Equipment" and "Directive on the Restriction of the Use of Certain Hazardous Substances in Electr...

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Problems solved by technology

[0004] Compositions in CN1723243A and Japanese Patent No.2001 / 302,879 disclose reactive phosphonate esters, but they are all used as flame retardants, and only the hydroxyl groups of phosphonate esters can react with epoxy resins. This phosphonate ester hydroxyl equivalent High curing efficiency is low, and the composition needs to add additional curing agents such as benzoxazine, phenolic formaldehyde, etc., and the addition of these curing agents will deteriorate the dielectric properties of the cured product, making it difficult to meet the dielectric performance requirements of thermosetting high-speed laminates. And the content of benzoxazine is more, it is difficult to achieve lower dielectric properties

[0005] In addition, the phosphonate disclosed in the specification of CN1723243A requires a phosphorus content greater than about 12%. The phosphorus content of this phosphonate is too high and the distribution is dense, and the cured product is easy to absorb water, and it is easy to absorb moisture when used in printed circuit laminates.

Moreover, CN1723243A does not limit the molecular weight of phosphonate

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