DPC ceramic circuit board and preparation method thereof

A technology of circuit boards and ceramic substrates, which is applied in the direction of circuit substrate materials, printed circuit manufacturing, printed circuits, etc., can solve problems such as scratches on the surface of the metal layer, and achieve the effect of improving reflectivity and good thickness uniformity

Inactive Publication Date: 2018-06-15
国瓷赛创电气(铜陵)有限公司
View PDF4 Cites 10 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to provide a DPC ceramic circuit board and a preparation method thereof, which solves the problem that scratches can be produced on the surface of the metal layer by grinding or polishing in the prior art, and can make the surface of the DPC ceramic circuit board obtain The mirror effect improves the reflectivity of the circuit board, and the thickness uniformity of the processed circuit board is very good

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • DPC ceramic circuit board and preparation method thereof
  • DPC ceramic circuit board and preparation method thereof
  • DPC ceramic circuit board and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0034] The present invention provides a DPC ceramic circuit board and a preparation method thereof. In order to make the present invention more obvious and understandable, the invention will be further described below in conjunction with the accompanying drawings and specific embodiments.

[0035] A kind of preparation method of DPC ceramic circuit board, as figure 1 Shown, be the preparation flowchart of DPC ceramic circuit board of the present invention, this method comprises:

[0036] (1) Prepare an electroplated thickened ceramic substrate 103, the electroplated thickened ceramic substrate 103 includes: a ceramic substrate 102, and a metal layer arranged on the ceramic substrate 102, the metal layer has a copper circuit;

[0037] (2) Cutting treatment: the surface of the electroplated thickened ceramic substrate 103 is subjected to metal cutting treatment. During the cutting process, the ambient temperature is controlled to be room temperature, and the temperature of the e...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
pore sizeaaaaaaaaaa
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
Login to view more

Abstract

The invention discloses a DPC ceramic circuit board and a preparation method thereof. The method comprises the following steps: an electroplated thickened ceramic substrate is prepared, wherein the electroplated thickened ceramic substrate includes a ceramic substrate and a metal layer arranged on the ceramic substrate, and there is a copper line on the metal layer; and cutting is carried out: metal cutting is carried out on the surface of the electroplated thickened ceramic substrate, and in the process of cutting, a platform for placing the electroplated thickened ceramic substrate is a shock absorption platform, the ambient temperature and the temperature of the electroplated thickened ceramic substrate are controlled at room temperature, the precision range of temperature is +/-2DEG C,and rotary cutting is adopted. The circuit board preparation method of the invention avoids a certain degree of damage to the substrate caused by grinding and polishing, and the high requirement fora mirror surface can be hardly achieved by the cutting in the prior art. By using the circuit board preparation method of the invention, the DPC ceramic circuit board has a mirror surface, the reflectivity of the circuit board is improved, and the thickness of the circuit board after processing is very uniform.

Description

technical field [0001] The invention relates to the field of preparation of ceramic substrates, in particular to a DPC ceramic circuit board and a preparation method thereof. Background technique [0002] With the gradual deepening of electronic technology in various application fields, highly integrated circuit boards have become an inevitable trend. Highly integrated package modules require a good heat dissipation carrying system, while traditional circuit boards FR-4 and CEM-3 are in TC (thermal conductivity ) has become a bottleneck restricting the development of electronic technology. In the field of high-power LED lighting, materials with good heat dissipation properties such as metal and ceramics are often used to prepare circuit substrates, and the thermal conductivity of ceramic substrates can reach about 220W / M.K according to different preparation methods and material formulations. [0003] Ceramic circuit boards mainly include four categories: HTCC (High-Temperat...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/26H05K1/03
CPCH05K1/0306H05K3/26H05K2203/0228
Inventor 章帅徐慧文于正国
Owner 国瓷赛创电气(铜陵)有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap