Semiconductor cooling device used in dispensing process and cooling control method thereof
A cooling device and semiconductor technology, applied in machines using electric/magnetic effects, devices for coating liquid on surfaces, and machine operation modes, etc., can solve the problems of strong volatility of organic solvents, low production efficiency, etc. Simple, small footprint, and the effect of reducing the frequency of changing glue
Inactive Publication Date: 2018-06-29
NANJING CHINA ELECTRONICS PANDA CRYSTAL TECH CORP
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Problems solved by technology
[0005] The invention is a semiconductor cooling device and a cooling control method used in the glue dispensing process, and its purpose is to solve the problems of strong organic solvent volatility and low production efficiency of conductive adhesives in the prior art at room temperature
Method used
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Embodiment 1
[0035] The needle tube part 1.1 used for dispensing is integrated with the needle part 1.2 used for dispensing, which is called the dispensing needle tube 1;
[0036] The connection part 2.1 connecting the dispensing machine and the dispensing needle tube fixing block, the cooling block 2.2, the dispensing needle tube fixing head 2.3 and the lock 2.4 are integrated, which is called the dispensing needle tube fixing block 2;
[0037] The heat sink 4 and the semiconductor cooler 3 are tightly attached together through the heat dissipation paste. The small fan 5 mainly discharges the heat on the heat sink 4 to the surrounding environment, and the semiconductor cooler 3 and the cold guide block 2.2 are also closely attached together through the heat dissipation paste. . Then use screws to assemble the small fan 5, the heat sink 4, the semiconductor cooler 3 and the cooling block 2.2 in sequence.
[0038] The semiconductor cooler 3 adopts advanced semiconductor cooling technology,...
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The invention relates to a semiconductor cooling device used in a dispensing process and a cooling control method thereof. The cooling device comprises a dispensing needle tube, a dispensing needle tube fixing block, a semiconductor refrigerator, cooling fins, a small fan, a temperature sensor and a temperature controller. The cooling control method comprises the following steps that 1, the semiconductor cooling device is installed; 2, the required temperature is set on the temperature controller; 3, when the temperature value of the dispensing needle tube fixing block collected by the temperature sensor is higher than the set temperature, the semiconductor refrigerator is driven to work; and 4, heat generated by a heat end of the semiconductor refrigerator is discharged through the cooling fins and the small fan. The semiconductor cooling device and the cooling control method thereof have the advantages that 1, no noise is generated, vibration is avoided, no refrigerant is needed, thesize is small, the weight is light, the work is reliable operation is simple and convenient, the cooling capacity is easy to adjust, and the device and the method are suitable for occasions with small cold consumption and small occupied space; and 2, volatilization of an organic solvent in a conductive adhesive is slowed down, the service life of the conductive adhesive is prolonged, meanwhile, the frequency of adhesive changing is reduced, and material cost is reduced.
Description
technical field [0001] The invention relates to a semiconductor cooling device used in a dispensing process and a cooling control method, belonging to the field of quartz crystal electronic component manufacturing. Background technique [0002] The dispensing process is an important process in the quartz crystal manufacturing industry, especially the popularity of miniaturized crystal products with a size of 2.5mm×2.0mm, 2.0mm×1.6mm, and 1.6mm×1.2mm, and the thickness of the crystal becomes thinner and thinner , it requires the glue dots to change from a total of four glue dots up and down to two glue dots below, which requires the dispensing process to be more precise and the viscosity of the conductive adhesive to be stronger and stronger. [0003] The conductive adhesive used in the dispensing process is composed of metal powder and organic solvent. The organic solvent has strong volatility at room temperature, weak volatility at 10~20°C, and non-volatile at -25°C. , so ...
Claims
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IPC IPC(8): B05C5/00B05C5/02F25B21/02
CPCB05C5/001B05C5/02F25B21/02F25B2321/021F25B2321/0251
Inventor 葛泳敏曾雳卞玉李坡张龙桃
Owner NANJING CHINA ELECTRONICS PANDA CRYSTAL TECH CORP