MEMS microstructural four-axis shock excitation device using piezoelectric ceramics as excitation source

Abstract

The invention discloses an MEMS microstructural four-axis shock excitation device using piezoelectric ceramics as an excitation source. The device comprises a sleeve, a baseboard, the piezoelectric ceramics, a pressure sensor, upper and lower linking blocks, an elastic support piece and an MEMS microstructure, wherein an annual top board is arranged at the upper end of the sleeve, and the microstructure is arranged on the annular top board via the elastic support piece; guiding shafts are uniformly distributed between the annular top board and the baseboard, guiding support arms are distributed on the lower linking block and pass through the sleeve wall to sleeve the guiding shafts, and a locking device is arranged on the guiding support arms; the upper and lower linking blocks are separately provided with a spherical groove and a spherical bump; the piezoelectric ceramics is clamped between the pressure sensor and the elastic support piece; and the outer edge of the upper linking block is ejected into the inner wall of the sleeve via ball plungers uniformly distributed and connected. The device can apply different sizes of pretightening force to the piezoelectric ceramics, so thatthe acquired measured value of the pretightening force is more accurate, and thus an adjustment process for compensating a parallelism error of two working surfaces of the piezoelectric ceramics canbecome smoother, and the tests of dynamic characteristic parameters are facilitated.

Description

Technical field [0001] The invention belongs to the technical field of micro-mechanical electronic systems, and particularly relates to a MEMS micro-structure four-axis vibration excitation device using piezoelectric ceramics as an excitation source. Background technique [0002] Because MEMS micro-devices have the advantages of low cost, small size and light weight, they have broad application prospects in many fields such as automobiles, aerospace, information communication, biochemistry, medical treatment, automatic control, and national defense. For many MEMS devices, the small displacements and small deformations of their internal microstructures are the basis for the realization of device functions. Therefore, accurate testing of the amplitude, natural frequency, damping ratio and other dynamic characteristics of these microstructures has become the development of MEMS products. important content. [0003] In order to test the dynamic characteristic parameters of the microst...

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Problems solved by technology

[0006] 2. There is no direct connection between the upper connection block and the lower connection block and the sleeve, but are installed in the sleeve in turn by means of clearance fit. If the parallelism error of the two working surfaces of the stacked piezoelectric ceramics is large , there is not enough space to adjust the movable base structure;

[0007] 3. The pressure sensor is installed at the bottom of the lower connecting block. Since the movable base structure adjusts itself, there is a certain inclination between the bottom of the lower connecting block and the working surface of the piezoelectric ceramic, so the pre-tightening force measured by the pressure sensor Or the output force of piezoelectric ceramics is not accurate; in addition, if the movable base structure causes the upper coupling block or the lower coupling block to contact the sleeve after adjustment, the error of the measurement result will further increase;

[0009] 5. In this device, gaskets of different thicknesses are used to change the magnitude of the pre-tightening force applied to the stacked piezoelectric ceramics, which makes the adjustment process complicated and not flexible enough

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