Infrared thermal wave non-destructive detection method

A non-destructive testing and infrared thermal wave technology, which is applied in the direction of material defect testing, etc., can solve problems such as being easily affected by subjective and objective conditions, difficult to save flaw detection results, and difficult flaw detection technology, so that the equipment is harmless to the human body and the equipment is simple. Lightweight and fast results

Inactive Publication Date: 2018-07-03
HARBIN DONGZHUAN TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The traditional flaw detection technology is analog, which has some unavoidable shortcomings, such as the defect display is not intuitive, the flaw detection technology is difficult, easily affected by subjective and objective conditions, and the flaw detection results are not easy to save. Non-destructive testing method, which is a special equipment for flaw detection by using the acoustic properties of the internal defects of the material itself to detect flaws. It is the product of the continuous development of ultrasonic flaw detection technology. Its progress and development embody ultrasonic flaw detection. Technological progress and development

Method used

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Embodiment 1

[0024] Infrared thermal wave non-destructive testing method, non-destructive detection of the size, shape and distribution of material surface and internal defects (such as cracks, bubbles, slag inclusions, etc.) The hardware design of the system's ultrasonic flaw detection system provides a wealth of peripheral equipment interfaces, and proposes and realizes the FPGA design of modules such as non-coherent digital envelope detection, positive and negative delay control, and hardware real-time alarm. A three-stage cascaded analog front-end design of controllable gain op amps is proposed and implemented, which meets the requirements of broadband, high gain, high dynamic range and high sampling frequency. A DC / DC converter and The power solution combined with the low dropout (LDO) voltage regulator improves the conversion efficiency of the power supply and enhances the stability of the whole system.

Embodiment 2

[0026] In the infrared thermal wave non-destructive testing method described in Embodiment 1, the housing 3 has a high-speed data acquisition circuit 5, an FPGA preprocessing circuit 8 and an ARM post-processing circuit 11, and the housing 3 also has a power supply 6 and a high voltage generator. 4. The high-speed data acquisition circuit is electrically connected to the FPGA pre-processing circuit, the FPGA pre-processing circuit is electrically connected to the ARM post-processing circuit, and the power supply provides electric energy for all electrical systems in the housing. The described The high-speed data acquisition circuit and the high-voltage generator are respectively connected to the probe 1 located outside the housing through wires 2 .

[0027] Example 2:

[0028] In the infrared heat wave nondestructive testing method described in embodiment 1, the described FPGA preprocessing circuit is also connected with a clock management system 7, a system reset device 9 and...

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Abstract

The invention relates to an infrared thermal wave non-destructive detection method. In the prior art, the traditional flaw detection is an analog mode, and has the following disadvantages that the defect display is not intuitive, the flaw detection technology is difficult and is easily affected by the subjective and objective conditions, and the flaw detection result is not easily saved. Accordingto the present invention, with the infrared thermal wave non-destructive detection method, the size, the shape and the distribution condition of the surface defects and the internal defects (such ascracks, gas bubbles, slag inclusion and the like) of the material can be non-destructively detected and the property of the material can be detected, the hardware of the ultrasonic wave flaw detectionsystem based on an ARM platform and an FPGA subsystem is designed, the rich peripheral equipment interfaces are provided, the FPGA design of the non-coherent digital envelope demodulation, the positive and negative delay control, the hardware real-time alarm and other modules is provided and achieved, the analog front-end design of the gain-controllable operational amplification three-level cascade is provided and achieved, the index requirements on wideband, high gain, high dynamic range and high sampling frequency are met, the power supply solving scheme combining the DC/DC converter and the low-dropout (LDO) regulator is designed and achieved, the conversion efficiency of the power supply is increased, and the stability of the whole system is enhanced; and the infrared thermal wave non-destructive detection method is used for non-destructive detection.

Description

Technical field: [0001] The invention relates to the field of nondestructive testing, in particular to an infrared thermal wave nondestructive testing. Background technique: [0002] The traditional flaw detection technology is analog, which has some unavoidable shortcomings, such as the defect display is not intuitive, the flaw detection technology is difficult, easily affected by subjective and objective conditions, and the flaw detection results are not easy to save, etc. Non-destructive testing method, which is a special equipment for flaw detection by using the acoustic properties of the internal defects of the material itself to detect flaws, is the product of the continuous development of ultrasonic flaw detection technology, and its progress and development embody ultrasonic flaw detection. Technological progress and development. Invention content: [0003] The purpose of the present invention is to provide an infrared thermal wave non-destructive testing method. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N25/72
CPCG01N25/72
Inventor 王冠红
Owner HARBIN DONGZHUAN TECH
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