Thin film packaging structure, flexible display panel, and thin film packaging structure making method
A technology of thin film packaging and manufacturing methods, which is applied to semiconductor devices, electrical components, circuits, etc., can solve problems such as insufficient storage life, and achieve the effect of improving storage life
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[0022] In order to further explain the technical means and effects adopted by the present invention to achieve the intended invention purpose, the specific implementation, structure, features and effects of the present invention will be described in detail below in conjunction with the accompanying drawings and preferred embodiments.
[0023] The orientations "upper" and "lower" mentioned in the description of the present invention are only used to indicate the relative orientation relationship, and refer to the positional relationship embodied in the drawings of the specification.
[0024] figure 1 It is a structural schematic diagram of the thin film encapsulation structure of the embodiment of the present invention. For the convenience of description, figure 1 In addition to the thin film encapsulation structure 10 , it also includes a thin film transistor 20 and an organic light emitting diode 30 disposed in the middle above the thin film transistor 20 . Specifically, see...
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