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Semiconductor automatic chip loading mechanism and operation method

An operating method and semiconductor technology, applied in the fields of semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problems of labor and time-consuming, low efficiency of manual loading, and save time, improve production efficiency, and improve the degree of automation. Effect

Active Publication Date: 2020-06-23
JCET GROUP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The efficiency of manual film loading is low, labor-intensive and time-consuming

Method used

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  • Semiconductor automatic chip loading mechanism and operation method
  • Semiconductor automatic chip loading mechanism and operation method
  • Semiconductor automatic chip loading mechanism and operation method

Examples

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Comparison scheme
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Embodiment Construction

[0024] see Figure 1 to Figure 3 , the present invention relates to a semiconductor automatic chip loading mechanism, which includes a workbench 1, a vibrating plate 4, a guide rail 5, and a turntable mechanism 8. Bulk devices are put into the vibrating plate 4, and the vibrating plate 4 is started, and the bulk devices pass through the vibrating plate in an orderly and orderly manner. 4 The guide rail 5 connected at the end is transferred to the guide rail discharge station 6.

[0025] Wherein guide rail 5 is a track changing guide rail, and it is made up of guide rail fixed end 13 and guide rail movable end 14, and the top of described vibration plate 4 is provided with visual sensor 10, is used for detecting the bulk device of feeding in vibration plate 4, obtains bulk device The size data and the signal of the visual sensor 10 are transmitted to the servo motor 11, the servo motor 11 drives the cam transmission box 12 to move, the cam transmission box 12 is connected to th...

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PUM

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Abstract

The invention relates to an automatic semiconductor loading mechanism and a running method thereof. The automatic semiconductor loading mechanism comprises a workbench, a vibration plate, a guide railand a turntable mechanism. A bulk device is placed into the vibration plate. After the vibration plate is started, the bulk device is transmitted to a guide rail discharging station by a guide rail connected by the tail end of the vibration plate. A blue membrane plate with a blue membrane pasted is installed at the workbench and is pushed to a drive receiving station by an XY axis driver. The turntable mechanism is arranged above the guide rail discharging station; the top of the turntable mechanism is driven by a mandrel motor to work; and a vacuum suction head is arranged at the bottom ofthe turntable mechanism. According to the automatic semiconductor loading mechanism, arrangement of bulk devices on the blue membrane is realized by using the mechanism to replace a worker, so that the automation degree of the entire semiconductor loading process is improved. Meanwhile, the bulk devices of different sizes can be automatically recognized and guide rails are changed automatically tomeet different size needs; the time of the debugging mechanism is saved; and the production efficiency is improved.

Description

technical field [0001] The invention relates to an automatic semiconductor chip loading mechanism and an operating method, belonging to the technical field of semiconductor packaging. Background technique [0002] Some semiconductor packages have bulk heat sinks (such as QFN products) or bulk devices. In order to realize automatic production on the chip loader, jigs such as blue film and patch ring are commonly used to arrange the bulk heat sinks in order and then input them into the chip loader. equipment. However, unlike wafers that are cut into entire single chips on the blue film, bulk heat sinks can only be manually arranged by the operator on the blue film, and then sent to the chip loading machine for production. Manual film loading is inefficient, labor-intensive and time-consuming. Contents of the invention [0003] The purpose of the present invention is to overcome the above-mentioned shortcomings and provide an automatic semiconductor chip loading mechanism, ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67
CPCH01L21/67271
Inventor 石巍
Owner JCET GROUP CO LTD
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