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Polishing pad having base layer and window attached thereto

A polishing pad, base layer technology, used in abrasive tools, other chemical processes, chemical instruments and methods, etc.

Active Publication Date: 2021-01-05
CMC材料有限责任公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

a first opening through the polishing layer and a second opening through the base layer

Method used

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  • Polishing pad having base layer and window attached thereto
  • Polishing pad having base layer and window attached thereto
  • Polishing pad having base layer and window attached thereto

Examples

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Embodiment Construction

[0016] Described herein are polishing pads having a base layer and windows attached to the base layer, and methods of making the same. In the following description, numerous specific details are set forth, such as specific polishing pad structures, designs, and compositions, in order to provide a thorough understanding of embodiments of the invention. It will be apparent to those skilled in the art that the embodiments of the invention may be practiced without these specific details. In other instances, well-known processing techniques, such as details regarding the combination of slurries and polishing pads to perform CMP of semiconductor substrates, have not been described in detail so as not to unnecessarily obscure embodiments of the invention. Furthermore, it should be understood that the various embodiments shown in the figures are illustrative representations and are not necessarily drawn to scale.

[0017] One or more embodiments described herein relate to a polishing...

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Abstract

The disclosure describes polishing pads having a base layer and windows attached to the base layer, and methods of making the polishing pads. In one example, a polishing pad for polishing a substrate includes a base layer having a first modulus. A polishing layer is attached to the base layer and has a second modulus lower than the first modulus. A first opening passes through the polishing layer and a second opening passes through the base layer. The first opening exposes at least a portion of the second opening and exposes a portion of the base layer. A window is disposed in the first opening and attached to the exposed portion of the base layer.

Description

【Technical field】 [0001] Embodiments of the invention are in the field of chemical mechanical polishing (CMP), and in particular, polishing pads having a base layer and windows attached to the base layer, and methods of making the same. 【Background technique】 [0002] Chemical mechanical planarization or chemical mechanical polishing (often abbreviated as CMP) is a technique used in semiconductor manufacturing to planarize semiconductor wafers or other substrates. [0003] This method uses abrasives and aggressive chemical slurries (usually colloids), combined with polishing pads and retaining rings that are usually larger in diameter than the wafer. The polishing pad and wafer are pressed together by the dynamic polishing head and held in position by the plastic retaining ring. The dynamic polishing head rotates during polishing. This method facilitates material removal and tends to smooth out any irregularities, making the wafer flat or planar. This may be necessary in ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B37/20B24B37/22B24B37/24B24B37/26C09K3/14H01L21/321
CPCB24B37/205B24B37/24B24B37/22B24B37/26C09K3/14H01L21/3212B24B37/16
Inventor P.A.勒费夫尔W.C.阿利森D.斯科特J.阿尔诺
Owner CMC材料有限责任公司