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Method for manufacturing miniature heat pipe

A manufacturing method and micro-heat pipe technology, applied in the field of mold manufacturing, can solve the problems of complex processing, high processing difficulty, and impossibility, and achieve the effect of simple process method and low processing difficulty

Inactive Publication Date: 2018-08-03
NANTONG UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the spinning process of grooved tubes is extremely complex and difficult to process, and many problems such as tool manufacturing and cost control need to be solved urgently.
At the same time, this processing principle also determines that it is more difficult or even impossible to directly process micro heat pipes with smaller dimensions.

Method used

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  • Method for manufacturing miniature heat pipe
  • Method for manufacturing miniature heat pipe
  • Method for manufacturing miniature heat pipe

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Embodiment Construction

[0022] The application will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain related inventions, rather than to limit the invention. It should also be noted that, for ease of description, only parts related to the invention are shown in the drawings.

[0023] It should be noted that, in the case of no conflict, the embodiments in the present application and the features in the embodiments can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and embodiments.

[0024] Please refer to figure 1 , an embodiment of the present invention provides a method for manufacturing a micro heat pipe, comprising the steps of:

[0025] S1: Form a core material 1 with multiple ribs on the outer wall by 3D printing;

[0026] S2: forming a conductive metal layer 2 on the...

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Abstract

The invention discloses a method for manufacturing a miniature heat pipe. The method comprises the following steps that S1, a core material with multiple ribs is formed on the outer wall through 3D printing; S2, a conductive metal layer is formed on the outer peripheral surface of the core material; S3, a pipe wall metal layer is formed on the outer peripheral surface of the conductive metal layer; and S4, the core material is melted and removed. According to the method, the brand-new method is provided for manufacturing the miniature heat pipe, a core pipe is firstly formed by 3D printing, then different metal layers are formed on the surface of the core pipe by other processing methods, the formed metal layers can completely cover the surface of the core pipe, and then a chip can be melted and removed; by the adoption of the method, grooves in the inner wall of the miniature heat pipe can be well formed as well, moreover, the method is not influenced by the size of the miniature heatpipe, and the grooves with the small size can also be well formed as well; and the process method is simple, small in processing difficulty and completely suitable for batch production.

Description

technical field [0001] The present disclosure generally relates to the field of mold manufacturing, and more particularly, to a method of manufacturing micro heat pipes. Background technique [0002] Today's world economy has entered the development stage of informatization from industrialization. Microelectronics technology is the core technology of high-tech and information industry, and is the basic and strategic industry in the new economic era. Its core is high-integration chip technology. It has extremely important strategic significance in the national economy, national defense construction and modern information society. With the rapid development of digitalization and network informationization, the performance and function requirements of microelectronic products are getting higher and higher. In order to meet the needs of high-performance, multi-functional and portable microelectronic products, microelectronic chips continue to develop in the direction of high pe...

Claims

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Application Information

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IPC IPC(8): F28D15/04
CPCF28D15/046
Inventor 钱双庆曹红蓓张华吴媛媛
Owner NANTONG UNIVERSITY