Optimal pin distribution generation method for large-scale BGA (ball grid array) packaging based on transcendental knowledge

Abstract

The invention discloses an optimal pin distribution generation method for large-scale BGA (ball grid array) packaging based on transcendental knowledge. The method comprises the steps of replacing a packaged circuit with a matrix to perform the design of pin distribution, wherein elements inside the matrix include signal pins, power pins and ground pins, the three categories of pins are replaced with 0, 1 and 2 and filled into a first column vector of the matrix; beginning from the elements of the first column vector, sequentially performing displacement to obtain the elements of the next column, and finally obtaining a complete matrix; then changing a displacement distance to obtain a plurality of different matrixes; obtaining an optimal matrix according to a total inductance of each matrix and a return path quality, wherein the pin distribution corresponding to the matrix is the optimal pin distribution. According to the method, the time-consumption iterative search is not needed, the solving time is greatly shortened, an optimal solution configured at the same parameter is relatively stable, and the signal integrity of the packaged circuit is relatively strong.

Description

technical field [0001] The invention relates to the field of large-scale integrated circuit packaging, in particular to a method for generating optimal pin distribution of large-scale BGA packaging based on prior knowledge. Background technique [0002] With the development of semiconductor technology and information technology, the functions of a single integrated circuit have become more and more complex, which has led to a sharp increase in the number of input and output pins on the integrated circuit package, and the power consumption and electromagnetic compatibility problems have become increasingly prominent. Packaging technology puts forward higher requirements. In order to meet these requirements, ball grid array (BGA) packaging came into being. It makes a solder ball array on the bottom of the packaging substrate as the electrical connection between the chip and the printed circuit board. Other packages have higher pin counts. [0003] Although the BGA package can...

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Problems solved by technology

[0003] Although the BGA package can provide good connection performance, the sharp increase in the number of pins has gradually degraded the signal integrity under the BGA package, and through a reasonable pin distribution, the mutual inductance in opposite directions can be canceled out, thereby greatly reducing The impact of signal integrity, so how to find an optimal pin distribution is very important in chip design. Recently, some pin distribution generation methods based on random optimization algorithms have been proposed, which can effectively solve such problems. But it takes a long time for iterative search, and these algorithms are unstable, it is difficult to search for the same solution every time, which hinders its application in industrial production

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