Optimal Pinout Generation Method for Large-Scale BGA Package Based on Prior Knowledge

Abstract

The invention discloses a method for generating optimal pin distribution of large-scale BGA packaging based on prior knowledge, and uses a matrix instead of a package circuit to design the pin distribution, wherein the elements inside the matrix include signal pins, power pins, and ground Pins, replace these three types of pins with 0, 1, and 2 and fill them into the first column vector of the matrix, start with the elements of the first column vector, and then shift them in turn to get the next column of elements, and finally get a complete Matrix, and then change the shift distance to get multiple different matrices. According to the total inductance of each matrix and the quality of the return path, the optimal matrix can be obtained. The pin distribution corresponding to this matrix is ​​the optimal pin distribution. The invented method does not require time-consuming iterative search, which greatly shortens the solution time, and the optimal solution constructed under the same parameters is relatively stable, and the signal integrity of the packaged circuit is also strong.

Description

technical field [0001] The invention relates to the field of large-scale integrated circuit packaging, in particular to a method for generating optimal pin distribution of large-scale BGA packaging based on prior knowledge. Background technique [0002] With the development of semiconductor technology and information technology, the functions of a single integrated circuit have become more and more complex, which has led to a sharp increase in the number of input and output pins on the integrated circuit package, and the power consumption and electromagnetic compatibility problems have become increasingly prominent. Packaging technology puts forward higher requirements. In order to meet these requirements, ball grid array (BGA) packaging came into being. It makes a solder ball array on the bottom of the packaging substrate as the electrical connection between the chip and the printed circuit board. Other packages have higher pin counts. [0003] Although the BGA package can...

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Problems solved by technology

[0003] Although the BGA package can provide good connection performance, the sharp increase in the number of pins has gradually degraded the signal integrity under the BGA package, and through a reasonable pin distribution, the mutual inductance in opposite directions can be canceled out, thereby greatly reducing The impact of signal integrity, so how to find an optimal pin distribution is very important in chip design. Recently, some pin distribution generation methods based on random optimization algorithms have been proposed, which can effectively solve such problems. But it takes a long time for iterative search, and these algorithms are unstable, it is difficult to search for the same solution every time, which hinders its application in industrial production

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