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Epoxy adhesives with dithiooxamide adhesion promoters

A technology of epoxy resin and composition, applied in the direction of adhesive types, non-polymer adhesive additives, adhesives, etc., can solve the problems of brittleness, low cohesive energy density, and too soft

Inactive Publication Date: 2002-05-01
3M CO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Various relatively hydrophobic and / or highly cross-linked epoxies are available, but they are often expensive and difficult to apply, and are often brittle when fully cured
In some cases, these resins have low cohesive energy density or are too soft, thus lacking intrinsic bond strength

Method used

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  • Epoxy adhesives with dithiooxamide adhesion promoters

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0102] A two-component amine-cured epoxy adhesive containing a DTO compound was prepared as follows.

[0103] Preparation of coagulant

[0104] In order to prepare the coagulant composition, 43phr polyamides with amino groups at the end (the formula NH with an equivalent ratio of 2:1 2 -CH 2 -CH 2 -CH 2 -(-O-CH 2 -CH 2 -) 2 -O-CH 2 -CH 2 -CH 2 -NH 2 Diamine and dimer acid mixture (Empol TM , the reaction product obtained from Henkel Corp.) and calcium nitrate (2 phr) were mixed and then heated to 125° C. in a Meyers type mixer until a clear homogeneous solution was obtained. Cardolite TM 541 (11.9phr) and N,N'-dicyclohexyldithiooxamide (2phr) were added into the solution, stirred and dissolved at 125°C. The solution was then cooled to 80°C and Hycar was added with stirring TM 1300x16 (17.1phr) and Ancamine TM K54 (7.2phr). Then add filler GP7I (10phr) and Cabosil TM TS720 (1phr) and mix and disperse until a uniform dispersion is obtained. The mixture was the...

Embodiment 2

[0109] One-part epoxy adhesives containing DTO compounds were prepared as follows. Epoxy Eponr TM 828 (50.2phr) and Epon TM 1004 (17.9phr) and Paraloid TM 753 (12.5 phr) was mixed in a Meyers type mixer and heated to 125°C with stirring to form a homogeneous dispersion. The other 2 kinds of epoxy resin Ciba TM PY322 (23.5phr) and Eponex TM 1510 (8.4phr) was added to the dispersion and mixed. The adhesion promoter N,N'-dihydroxyethyldithiooxamide (1.65 phr) was added to the mixer and dissolved at 125°C. Allow the mixer to cool to 30 °C. Stir and add filler in the order listed: Shieldex TM (4.4phr), GP7I (37phr), Cabosil TM TS720 (2.9phr). Then cool the mixer to 20°C, stir and add the epoxy catalyst Amicure TM CG1200 (5.7phr) and nickel imidazole phthalate (2.3phr). Observe the contents of the mixer to ensure that a uniform dispersion has formed. The mixture is then vacuum degassed to remove entrained gases.

[0110] Test adhesives were produced by applying the obt...

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Abstract

The invention provides a curable, structural epoxy adhesive composition comprising: (a) an epoxy resin; (b) a curing agent for the epoxy resin; and (c) a compound of the formula (I) in which R1 and R2, which may be the same or different, are selected from an alkyl group, a hydroxyalkyl group, a cycloalkyl group, an aryl group, an arylalkyl group, or a heterocyclic group in which the one to three non-carbon atoms in the ring are independently selected from S, N, and O.

Description

field of invention [0001] The present invention relates to structural adhesive compositions comprising one or more epoxy resins and one or more dithiooxamides (DTO). Background of the invention [0002] Curable epoxy structural adhesive compositions are commonly used to bond metal parts. This type of operation is becoming more popular in the automotive industry, especially with the ever-increasing requirements for quietness, as gap bonding reduces or eliminates squeaks and increases body stiffness. Due to the production technology and scheme, the performance requirements for this adhesive are stringent. For example, metal surfaces are often coated with organic oil. In addition, more metal parts are galvanized as a means of corrosion protection. Zinc-rich surfaces of galvanized parts are difficult to adhere to. [0003] Many epoxy structural adhesives / metal components are damaged by prolonged water immersion or high humidity conditions, especially in the presence of disso...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J11/06C09J163/00
CPCC09J163/00C08L2666/28Y10T428/31522Y10T428/31515C09J11/06
Inventor V·C·马哈费卡A·L·格里格斯K·S·塔布藤
Owner 3M CO