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Semiconductor device

A semiconductor and lateral semiconductor technology, applied in semiconductor devices, electromechanical devices, circuit heating devices, etc., can solve problems such as poor thermal connection and poor electrical connection

Inactive Publication Date: 2018-08-10
JTEKT CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, there is a possibility of poor electrical connection at the joint between the lateral semiconductor element and the substrate, or poor thermal connection at the joint between the lateral semiconductor element and the heat sink.

Method used

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  • Semiconductor device
  • Semiconductor device
  • Semiconductor device

Examples

Experimental program
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Embodiment Construction

[0028] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. figure 1 It is a cross-sectional view schematically showing the configuration of a mechatronic motor unit to which the semiconductor device according to the first embodiment of the present invention is applied. The mechatronic motor unit 1 is, for example, a unit provided in an electric power steering device for a vehicle. The electromechanical integrated motor unit 1 includes an electric motor 2 , a power module 3 , and a housing 4 . The power module 3 realizes the driving circuit of the electric motor 2 . The casing 4 accommodates the power module 3 .

[0029] The electric motor 2 includes a motor case 21 , a rotor 22 , a rotor shaft 23 , and a stator 24 . The motor case 21 has a cylindrical shape and is composed of a cylindrical side wall 21A, a bottom wall 21B, and a top wall 21C. The bottom wall 21B closes the lower opening of the side wall 21A. The to...

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PUM

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Abstract

An electrode surface of a horizontal semiconductor chip and a substrate are joined together through a plurality of first joint portions including a plurality of joint portions at which a plurality ofelectrodes formed on the electrode surface are joined to the substrate. A no-electrode surface of the horizontal semiconductor chip and a heatsink are joined together through a second joint portion atwhich the no-electrode surface and the heatsink are joined together. In a plan view from a direction normal to a principal surface of the substrate, the region defined by the outline of a rough shapeof an aggregate of the first joint portions is set as a first joint region, the region defined by the outline of the second joint portion is set as a second joint region, and the first joint region and the second joint region are the same in position, shape, and size,.

Description

[0001] This application claims priority from Japanese Patent Application No. 2017-017827 filed on February 2, 2017, the entire contents of which are incorporated herein. technical field [0002] This invention relates to a semiconductor device used, for example, in an inverter circuit of an electric power steering device. Background technique [0003] In the inverter circuit of the electric power steering device, there is a possibility that the switching element may heat up rapidly in a short time. Therefore, the heat generated by the switching element is absorbed by the heat dissipation sheet by bonding the heat sink to the rear surface of the substrate to which the switching element is bonded. [0004] Conventionally, a vertical semiconductor element in which a drain electrode (or collector electrode) is provided on one surface and a source electrode (or emitter electrode) and a gate electrode (or base electrode) are provided on the other surface is generally used as a swi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/367
CPCH01L23/3672H01L23/3677H02K9/227H01L2224/30051H01L2224/30151H01L2224/30156H01L2224/14151H01L2224/33051H01L2224/81825H01L2224/14156H01L24/13H01L24/14H01L24/16H01L24/29H01L24/30H01L24/32H01L24/33H01L24/73H01L2224/13013H01L2224/131H01L2224/14051H01L2224/14517H01L2224/16227H01L2224/16245H01L2224/29013H01L2224/291H01L2224/32014H01L2224/32245H01L2224/33181H01L2224/73253H01L2224/81801H01L2224/83801H01L2224/83825H01L2924/3511H01L2224/30517H01L2924/014H01L2924/00012H01L2924/00014H01L23/36H01L29/4238H05K1/0201H05K2201/10439H01L23/5389H02K11/33H01L23/488
Inventor 谷直树
Owner JTEKT CORP