Camera image conversion system for vacuum packaged image sensor chip

An image sensor and image conversion technology, which is used in image communication, parts of TV systems, parts of color TV, etc. It can solve the problem of changing the vacuum degree of the objective lens, affecting the accuracy and clarity of the objective lens, and it is difficult for users to know and other problems to achieve better results and clearer images.

Pending Publication Date: 2018-08-10
LIGHT SPEED VISION BEIJING
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Problems solved by technology

[0006] Since the water vapor in the air can only be observed by the naked eye after condensation, when the vacuum degree in the objective lens is low, air enters the objective lens, as long as there is no condensation on the objective lens, it is difficult for the user to know The vacuum inside the objective lens has changed
However, the air entering the objective lens, the water vapor contained in it, etc. will also affect the accuracy and clarity of the objective lens

Method used

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  • Camera image conversion system for vacuum packaged image sensor chip
  • Camera image conversion system for vacuum packaged image sensor chip
  • Camera image conversion system for vacuum packaged image sensor chip

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Embodiment Construction

[0041] The present invention will be described in further detail below in conjunction with the accompanying drawings, wherein the same components are denoted by the same reference numerals. It should be noted that the words "front", "rear", "left", "right", "upper" and "lower", "bottom" and "top" used in the following description refer to the Directions, the words "inner" and "outer" refer to directions toward or away from, respectively, the geometric center of a particular component.

[0042] A camera image conversion system with a vacuum-encapsulated image sensor chip, combined with figure 1 and figure 2 As shown, it includes a housing 1, an image conversion module 2 arranged in the housing 1, a power supply module 3 for supplying power to the image conversion module 2, and a data processing module 4 for processing the signal of the image conversion module 2, wherein, in When in use, a lens is installed on the housing 1 and close to the image conversion module 2, the opti...

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Abstract

The invention discloses a camera image conversion system of a vacuum packaged image sensor chip. According to the technical scheme, the camera image conversion system of the vacuum package image sensor chip comprises a housing, an image conversion module, a power module for supplying power to the image conversion module and a data processing module for processing signals of the image conversion module, wherein the image conversion module, the power module and the data processing module are arranged in the housing; a sealed cavity is formed in the housing, and a vacuum degree monitoring moduleis disposed in the sealed cavity; a terminal control module is disposed on the outer side of the sealed cavity and connected to the vacuum degree monitoring module. The vacuum degree in the sealed cavity can be monitored in real time, vacuum degree signals can be sent in real time, and changes of the vacuum degree in the sealed cavity can be known more accurately and timely.

Description

technical field [0001] The invention relates to camera vacuum processing technology, more specifically, it relates to a camera image conversion system for vacuum packaging image sensor chips. Background technique [0002] A camera is a device that uses the principle of optical imaging to form an image and uses a film to record the image. After the light reflected by the subject is focused by the photographic lens (objective lens) and the shutter that controls the exposure, the photosensitive effect of the subject in the dark box A latent image is formed on the material. [0003] The image sensors used in existing cameras are SMOS image sensors and CCD image converters, both of which use photodiodes for photoelectric conversion to convert images into digital data, and the main difference is the way digital data is transmitted different. [0004] Since the CMOS sensor adopts the most commonly used CMOS process for general semiconductor circuits, peripheral circuits (such as ...

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Application Information

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IPC IPC(8): H04N5/225
CPCH04N23/54H04N23/50
Inventor 邱虹云
Owner LIGHT SPEED VISION BEIJING
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