Resin composition for transparent anti-static IC packaging tube

A resin composition and antistatic technology, which is applied in the field of transparent antistatic IC packaging tubes, can solve the problems of expensive raw materials, low modulus, and high difficulty in extrusion molding, and achieve stable extrusion production process and good antistatic Effect, the effect of a good balance of rigidity and toughness

Active Publication Date: 2018-08-14
KINGFA SCI & TECH CO LTD
View PDF10 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Transparent HIPS packaging tubes have good toughness and transparency, but the raw materials are expensive, while PET, PP, PE and other raw materials have low modulus and are crystalline materials, so extrusion molding is more difficult

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Resin composition for transparent anti-static IC packaging tube
  • Resin composition for transparent anti-static IC packaging tube
  • Resin composition for transparent anti-static IC packaging tube

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] An embodiment of the transparent antistatic IC packaging tube resin composition of the present invention, in this embodiment, the refractive index of the methyl methacrylate-styrene resin is 1.54, and the styrene-butadiene The refractive index of the copolymer is 1.56. In the methyl methacrylate-styrene resin, the molar ratio of methyl methacrylate to styrene monomer is: methyl methacrylate: styrene=1:1, so In the styrene-butadiene copolymer, the molar ratio of styrene to butadiene monomer is: styrene:butadiene=1:1. The composition of the transparent antistatic IC packaging tube resin composition is shown in Table 1.

Embodiment 2

[0035] An embodiment of the transparent antistatic IC packaging tube resin composition of the present invention, in this embodiment, the refractive index of the methyl methacrylate-styrene resin is 1.56, and the styrene-butadiene The refractive index of the copolymer is 1.57. In the methyl methacrylate-styrene resin, the molar ratio of methyl methacrylate to styrene monomer is: methyl methacrylate: styrene=3:7, so In the styrene-butadiene copolymer, the molar ratio of styrene to butadiene monomer is: styrene:butadiene=7:3. The composition of the resin composition for the transparent antistatic IC packaging tube described in this embodiment is shown in Table 1.

Embodiment 3

[0037] An embodiment of the transparent antistatic IC packaging tube resin composition of the present invention, in this embodiment, the refractive index of the methyl methacrylate-styrene resin is 1.56, and the styrene-butadiene The refractive index of the copolymer is 1.57. In the methyl methacrylate-styrene resin, the molar ratio of methyl methacrylate to styrene monomer is: methyl methacrylate: styrene=3:7, so In the styrene-butadiene copolymer, the molar ratio of styrene to butadiene monomer is: styrene:butadiene=7:3. The composition of the resin composition for the transparent antistatic IC packaging tube described in this embodiment is shown in Table 1.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
flexural modulusaaaaaaaaaa
refractive indexaaaaaaaaaa
refractive indexaaaaaaaaaa
Login to view more

Abstract

The invention discloses a resin composition for a transparent anti-static IC packaging tube. The resin composition is prepared from the following ingredients in parts by weight: 20 to 78 parts of methyl methacrylate-styrene resin, 20 to 78 parts of styrene-butadiene copolymers and 1 to 5 parts of anti-static agents. The resin composition for the transparent anti-static IC packaging tube uses methyl methacrylate-styrene (MS) as substrate resin, uses styrene-butadiene copolymers (SBC, also called as K glue) as a toughening agent for toughening, and has the advantages that the good rigidity and roughness balance is realized; the anti-static agents are added, so that the obtained resin composition has a good transparent effect and anti-static effects.

Description

technical field [0001] The invention relates to an IC packaging tube, in particular to a transparent antistatic IC packaging tube. Background technique [0002] The current production of IC (integrated circuit) packaging tubes is generally made of hard extrusion-grade PVC pellets (to produce PVC packaging tubes), extrusion-grade transparent HIPS pellets (to produce transparent PS packaging tubes), modified PET pellets ( Produce PET packaging tubes), PP and PE as raw materials. The production of IC packaging tubes in the market is dominated by PVC packaging tubes, accounting for 70% to 80% of the entire market. In recent years, in developed countries such as Europe, America, Japan and South Korea, IC packaging tubes are making rapid progress towards a more environmentally friendly and greener direction, especially the development momentum of transparent HIPS packaging tubes and PET packaging tubes. Transparent HIPS packaging tubes have good toughness and transparency, but t...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): C08L25/14C08L33/12C08L25/10C08L91/00C08K5/00C08K5/103C08K5/32C08K5/134C08K5/526C08K5/20
CPCC08L25/10C08L25/14C08L33/12C08L2201/04C08L2201/10C08L2203/18C08L2205/03C08L91/00C08K5/103C08K5/32C08K5/1345C08K5/526C08K5/20C08K5/00
Inventor 林士文黄险波叶南飚陈平绪官焕祥付锦峰肖鹏
Owner KINGFA SCI & TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products