Method and device for splitting a glass substrate
A technology for glass substrates and slivers, applied in glass cutting devices, glass manufacturing equipment, manufacturing tools, etc., can solve the problems of scattering, product quality, yield impact, easy generation of particle impurities, etc., so as to reduce the use cost, avoid quality and The impact of yield and the effect of avoiding particle impurities
Active Publication Date: 2020-12-25
WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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Problems solved by technology
Since the glass substrate itself is not cracked after cutting, a splitting process is required, but because the existing splitting methods and devices are prone to produce particle impurities during the splitting process, and the glass debris during the splitting process of the glass substrate is not controlled, It may be scattered to the display area or other areas on the surface of the glass substrate, affecting product quality and yield
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[0032] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the drawings in the embodiments of the present invention. Apparently, the described embodiments are only some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative efforts fall within the protection scope of the present invention.
[0033] The present invention aims at the glass substrate splitting method and device in the prior art. There are technical problems that glass debris and other particle impurities are easily generated during the splitting process, which affects the quality and yield of the glass substrate, and the straightness of the splitting is not good. This implementation example can solve this defect.
[0034] refer to figure 1 , is a schematic structural diagram of a glass substr...
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The invention provides a method and a device for shredding glass substrates. The device comprises a bearing table and a vacuum negative-pressure device. The bearing table is used for bearing a cut glass substrate; a cut notch is formed in a surface of the glass substrate, and the bearing table is exposed out of the cut notch; the vacuum negative-pressure device is arranged on a side of the bearingtable and is used for sucking air to the glass substrate; the vacuum negative-pressure device comprises a suction opening, and the suction opening corresponds to the cut notch; the air can be suckedby the vacuum negative-pressure device, so that vacuum negative pressures can be generated at the cut notch, the cut notch in the glass substrate can crack, and particle impurities generated in shredding procedures can be discharged to corresponding devices via the suction opening along with airflow formed between the vacuum negative-pressure device and the surface of the glass substrate.
Description
technical field [0001] The invention relates to the technical field of display panel processing, in particular to a method and a device for splitting a glass substrate. Background technique [0002] In the LCD and OLED display industries, it is necessary to use laser cutting or knife wheel cutting to cut large-sized glass substrates prepared with display devices; after the cutting is completed, splits need to be separated. Especially in the OLED production process, limited by the mature design of important process equipment, large-sized glass substrates must be cut and split. [0003] In the OLED production process, it is particularly sensitive to tiny particles of impurities. The entire production process needs to strictly control the tiny particles of impurities, and it is required to minimize the generation of particle impurities and maximize the discharge of particle impurities during the process. The existing mature cutting technology generally uses CO 2 The cutting m...
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IPC IPC(8): C03B33/033
CPCC03B33/033
Inventor 李启明
Owner WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD