Large power LED projection light fixture

Abstract

The invention discloses a large power LED projection light fixture including a light fixture bracket, at least one power supply, at least one LED projection light and a light source heat radiation assembly, wherein the light source heat radiation assembly includes a substrate with grooves and a plurality of heat radiation fins fixed to the substrate. The large power LED projection light fixture ofthe invention has a light weight and a small size and is easy to replace. The effective heat radiation area is large, so the usage life of the LED light fixture is long. The plane area of the heat radiation fins is small, the spacing distance is proper, the heat radiation fins cooperate with the grooves, and a vibration and an air flow caused by using environment are skillfully utilized. Therefore, self-cleaning is convenient and the reducing of a heat radiation effect caused by dust accumulating of an integral light fixture can be prevented.

Description

technical field [0001] The invention relates to a high-power LED projection lamp, in particular to a high-power LED projection lamp for a wharf suspension bridge. Background technique [0002] Compared with traditional light sources, LED lights have huge advantages, and have gradually become popular and used in all walks of life. In actual use, in order to take advantage of the long service life of LED lamps, the lamps are required to have a good heat dissipation function. The greater the power of the LED lamp, the higher the heat dissipation requirements. At present, the housings of lamps are basically molded to produce die-casting aluminum or plastic housings. The larger the size, the better the heat dissipation effect. Therefore, the maximum power of LED lamps is limited by the size of the lamp housing. When LED lights are applied to the lighting of large machinery such as bridge cranes, they are used at high altitudes and are constantly affected by vibration and wind; a...

AI Technical Summary

Problems solved by technology

This has a great impact on the heat dissipation of the lamp, especially for the LED chip. The coverage of dust reduces the heat dissipation coefficient of the heat sink. When the LED junction temperature exceeds the solid phase transition temperature (usually 125°C), the packaging material will turn to rubber transition and the coefficient of thermal expansion rises sharply, leading to open circuit and failure of the LED

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