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Camera module and manufacturing method thereof

A technology of a camera module and a manufacturing method, which is applied to radiation control devices, electrical components, electric solid-state devices, etc., can solve the problems of reducing the thickness of the camera module and the production process, and achieves the effect of reducing the production process and thickness.

Inactive Publication Date: 2018-08-28
SANECHIPS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] In order to solve the above technical problems, the embodiment of the present invention expects to provide a camera module and its manufacturing method, which solves the problem of secondary packaging between the optical sensor chip and the lens group in the prior art, and simplifies the packaging of the camera module. process, reducing the production process and reducing the thickness of the camera module

Method used

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  • Camera module and manufacturing method thereof
  • Camera module and manufacturing method thereof
  • Camera module and manufacturing method thereof

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Embodiment Construction

[0078] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the drawings in the embodiments of the present invention.

[0079] A camera module provided by an embodiment of the present invention is applied to a camera system of a mobile device, and the camera module is simplified. Refer to figure 1 As shown, the camera module includes: a protective cover 11 and an optical sensor chip 12, wherein:

[0080] An optical lens structure 111 is disposed on the first area of ​​the first plane of the protective cover 11 , and the protective cover 11 is integrated with the optical lens structure.

[0081] Wherein, the protective cover may be a sheet-shaped structure or a plate-shaped transparent material, such as glass or sapphire. The specific size of the optical lens structure can be determined by the specific use and design situation, and the optical lens structure that meets the specific requirements...

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Abstract

An embodiment of the invention discloses a camera module. The camera module comprises a protection cover and an optical sensing chip. A first area of a first plane of the protection cover is providedwith an optical lens structure. The protection cover and the optical lens structure are integrated. The optical sensing chip is arranged in a first area of a second plane of the protection cover, wherein the second plane is a surface opposite to the first surface of the protection cover. The center point of the first area of the first plane and the center point of the first area of the second plane are in the same line vertical to the first plane. The embodiment also discloses a manufacturing method of the camera module.

Description

technical field [0001] The invention relates to the packaging technology of a camera module in the field of semiconductor packaging, in particular to a camera module and a manufacturing method thereof. Background technique [0002] With the rapid development of science and technology, mobile devices tend to be simplified and miniaturized, so components are required to be smaller and thinner. In mobile devices such as smart phones and tablet computers, camera modules can provide functions such as taking pictures and video recordings. In the prior art, the camera module is usually assembled from a packaged optical sensor chip and a lens group; the packaging structure of the existing camera module requires more packaging steps, resulting in a lower yield rate of the finished product; and , the formed product is thicker. [0003] In the existing technical solutions, the optical sensor chip is usually embedded in the packaging substrate or the cut-off film is used instead of th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/146
CPCH01L27/14618H01L27/14627H01L27/14685H01L27/1469
Inventor 任晓黎
Owner SANECHIPS TECH CO LTD