Novel multi-layer printed circuit board
A multi-layer printing and circuit board technology, applied in the direction of printed circuit, printed circuit components, printed circuit structural connection, etc., can solve the problems of not being able to reach well, having a short service life, and not being able to reach the connection well, etc. To achieve the effect of protecting the circuit board
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[0025] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0026] 1, circuit board used in the present invention, 2, lower fixed column, 3, patch triode, 4, triode, 5, chip capacitor, 6, electrolytic capacitor, 7, upper fixed column, 8, support column, 9, Base, 10, flexible pipe, 11, telescopic tube, 12, movable clip, 13, fixed ring, 14, movable nail, 15, electric wire can all be purchased through market or private custom-made gain.
[0027] see Figure 1~3 , in the embodiment of the present invention, the new multi-...
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