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Multiplexer design using 2d passive on glass filter integrated with 3D through glass via filter

A multiplexer, through-glass via technology, applied in waveguide-type devices, circuits, multi-terminal-pair networks, etc., can solve problems such as increasing the Q value of inductors and capacitors

Pending Publication Date: 2018-08-31
QUALCOMM INC
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Increasing the Q of the inductors and capacitors in the duplexer is also a problem

Method used

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  • Multiplexer design using 2d passive on glass filter integrated with 3D through glass via filter
  • Multiplexer design using 2d passive on glass filter integrated with 3D through glass via filter
  • Multiplexer design using 2d passive on glass filter integrated with 3D through glass via filter

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Embodiment Construction

[0027] The detailed description set forth below in connection with the appended drawings is intended as a description of various configurations and is not intended to represent the only configurations in which the concepts described herein may be practiced. The detailed description includes specific details for the purpose of providing a thorough understanding of various concepts. However, it will be apparent to those skilled in the art that these concepts may be practiced without these specific details. In some instances, well-known structures and components are shown in block diagram form in order to avoid obscuring these concepts. As used herein, use of the term "and / or" is intended to mean an "inclusive or," and use of the term "or" is intended to mean an "exclusive or."

[0028] Due to cost and power consumption considerations, mobile radio frequency (RF) chip designs (eg, mobile RF transceivers) have migrated to deep sub-micron process nodes. The design complexity of m...

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Abstract

A multiplexer structure (500) includes a passive substrate (508). The multiplexer structure (500) may also include a high band filter (502) on the passive substrate. The high band filter (502) may include a 2D planar spiral inductor(s) (530, 540) on the passive substrate. The multiplexer structure (500) may further include a low band filter (504) on the passive substrate. The low band filter (504)may include a 3D through-substrate inductor (510, 520) and a first capacitor(s) on the passive substrate. The multiplexer structure (500) may also include a through substrate via(s) (VIA) coupling the high band filter (502) and the low band filter (504).

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS [0002] US Provisional Patent Application No. 62 / 271,893, entitled "MULTIPLEXERDESIGN USING A 2D PASSIVE ON GLASS FILTER INTEGRATED WITH A 3D THROUGH GLASSVIA FILTER," filed December 28, 2015 as required by this application under 35 U.S.C. §119(e) , the disclosure of which is expressly incorporated herein by reference in its entirety. technical field [0003] The present disclosure generally relates to integrated circuits (ICs). More specifically, the present disclosure relates to multiplexer designs using 2D passive on glass (POG) filters integrated with 3D through glass via (TGV) filters. Background technique [0004] For wireless communications, duplexers can help process signals carried in a carrier aggregation system. In a carrier aggregation system, signals are communicated using both high frequency and low frequency bands. In chipsets, a duplexer is usually inserted between the antenna and the tuner (or radio frequen...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H03H7/46
CPCH03H7/463H03H7/0115H01P5/16H01Q1/22H01Q1/50
Inventor C·H·芸D·D·金M·F·维勒兹左丞杰D·F·伯迪金钟海
Owner QUALCOMM INC
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