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Automatic wafer testing machine

A wafer testing and machine technology, used in semiconductor/solid state device testing/measurement, conveyor objects, electrical components, etc., and can solve problems such as low test efficiency

Pending Publication Date: 2018-09-04
SHENZHEN JPT OPTO ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Based on this, it is necessary to provide an automated wafer testing machine with high test efficiency for the problem of low test efficiency in the traditional

Method used

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Embodiment Construction

[0031] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. Preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0032] It should be noted that when an element is referred to as being “fixed” to another element, it can be directly on the other element or there can also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and similar expressions are used herein for purposes ...

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Abstract

The invention relates to an automatic wafer testing machine used for fixing and testing a chip located on a wafer. The automatic wafer testing machine comprises a machine, an angle adjustment mechanism, a wafer test positioning device, a test component and a controller. The machine is provided with a test station. The angle adjustment mechanism comprises a rotation component and a translation component. The wafer test positioning device is installed on the surface of the angle adjustment mechanism, wherein the surface faces away from an installation surface. The angle adjustment mechanism candrive the wafer test positioning device to rotate or translate so as to drive the chip to move to the test station. The test component is used for carrying out performance detection on the chip located at the test station. The controller, the angle adjustment mechanism and the test component are connected in a communication connection mode. The controller is used for sending trigger signals to theangle adjustment mechanism and the test component respectively so as to trigger the angle adjustment mechanism and the test component. The automatic wafer testing machine has characteristics that a test speed is fast and test efficiency is high.

Description

technical field [0001] The invention relates to the technical field of wafer testing, in particular to an automatic wafer testing machine. Background technique [0002] Wafer refers to the silicon wafer used in the manufacture of silicon semiconductor integrated circuits. Various chips can be processed on the wafer, making the wafer a product with specific functions. During wafer processing, it is usually necessary to fix the wafer on a wafer testing machine, and perform optical and electrical performance tests on the chips placed on the wafer one by one. However, the existing wafer testing machine has slow testing speed and low testing efficiency. Contents of the invention [0003] Based on this, it is necessary to provide an automated wafer testing machine with high testing efficiency to solve the problem of low testing efficiency in traditional methods. [0004] An automated wafer testing machine for fixing and testing chips on a wafer, including: [0005] The suppo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/66H01L21/677
CPCH01L21/67796H01L22/10
Inventor 许根夫
Owner SHENZHEN JPT OPTO ELECTRONICS CO LTD
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