Integrated chip processing device

Abstract

The invention discloses an integrated chip processing device, and the device comprises a processing unit body, and a conveying cavity which is disposed in the processing unit body and is laterally through. The interior of the processing unit body is sequentially provided with a metal spluttering coating cavity, a coating light resistance cavity, a photoetching cavity and a first sliding guide groove from the left to the right, wherein the openings of the metal spluttering coating cavity, the coating light resistance cavity, the photoetching cavity and the first sliding guide groove face downwards and are communicated with the conveying cavity. The interior of the processing unit body is provided with a second sliding guide groove which is communicated with the conveying cavity, wherein theopening of the second sliding guide groove face upwards. The front and rear inner walls of the second sliding guide groove are symmetrically provided with guide rail grooves in a communicated manner,wherein the guide rail grooves extend along the second sliding guide groove. The rear end inner wall of the second sliding guide groove is provided with a first displacement sensor which is located exactly below the central axis of the metal spluttering coating cavity, the coating light resistance cavity, the photoetching cavity and the first sliding guide groove. The device is simple in structure, is convenient to operate, is precise in processing, and improves the processing efficiency and effect of an integrated chip.

Description

technical field [0001] The invention relates to the technical field of integrated chip processing, in particular to an integrated chip processing device. Background technique [0002] At present, integrated chips have become the essential core electronic components of global electronic products. There are also certain strict requirements for the processing of integrated chips. General and traditional integrated chip packaging equipment adopt rough processing procedures and complicated operations, which will cause irreversible effects. , Improper coordination between the various processes affects chip performance. At the same time, due to the unstable processing position, the effects of each process are not good, and the circuits of each layer are broken or short-circuited. Therefore, an integrated chip processing device is urgently needed at present. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide an integrated c...

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Problems solved by technology

[0002] At present, integrated chips have become the essential core electronic components of global electronic products. There are also certain strict requirements for the processing of integrated chips. General and traditional integrated chip packaging equipment adopt rough processing procedures and complicated operations, which will cause irreversible effects. , the inappropriate coordination between the various processes affects the performance of the chip. At the same time, due to the unstable processing position, the effect of each process is not good, and the circuits of each layer are broken or short-circuited. Therefore, an integrated chip processing device is urgently needed at present.

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