Automatic cleaning machine for gum film of modularized integrated circuit chip

Abstract

The invention discloses an automatic cleaning machine for a gum film of a modularized integrated circuit chip. A cross beam is arranged the top of a stander, a grinding guide rail is arranged in the middle of the stander; a plurality of grinding mechanisms are mounted on the cross beam on the stander in an equal interval manner and comprise reciprocating driving devices, sliding blocks, pressure sensors and bow-shaped grinding assemblies; the reciprocating driving devices are fixed on the cross beam; the sliding blocks are connected with the grinding guide rail; the reciprocating driving devices drive the sliding blocks to slide in a reciprocating manner on the grinding guide rail; the tops of the pressure sensors are fixedly connected with the sliding blocks, and the bottoms of the pressure sensors are fixedly connected with the bow-shaped grinding assemblies; the bow-shaped grinding assemblies are arranged above the integrated circuit chip; and a chip fixing mechanism is arranged atthe bottom in the stander, and the integrated circuit chip is fixedly placed on the chip fixing mechanism. The grinding mechanisms are modularized and can be mounted on the cross beam of the stander in an equal interval manner, so that the modularized combined mounting is realized, and the formation of a flow production line is facilitated.

Description

Technical field [0001] The invention relates to an automatic cleaning machine for the back glue film of a modular integrated circuit chip. Background technique [0002] Integrated circuit chips will inevitably form back glue during the preparation and packaging process, which affects the electrical conductivity of the circuit and the reliability of soldering and installation. Therefore, the mounting surface must be de-glued. Existing integrated circuit chip adhesive cleaning machines all use flat or roller-shaped abrasives, which have the problems of difficult control of motion accuracy and unsatisfactory cleaning effects, resulting in low product yields and, more importantly, difficulty in assembly line operation. Summary of the invention [0003] The purpose of the present invention is to provide a modular automatic cleaning machine for the back glue film of integrated circuit chips, which can adapt to assembly line operation. [0004] The technical solution to achieve the objec...

AI Technical Summary

Problems solved by technology

Existing integrated circuit chip adhesive cleaning machines all use flat or roller-shaped grinding tools, which have the problems of difficult control of motion accuracy and unsatisfactory cleaning effect, resulting in low product yield, and more importantly, it is difficult to operate in an assembly line

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