The invention discloses a high-precision automatic removing
machine for a back
adhesive film of an
integrated circuit chip. A cross beam is arranged at the top of a rack, and a plurality of
grinding guide rails are arranged in the middle of the rack. The
grinding mechanisms are mounted on the cross beam of the rack at equal intervals. Each
grinding mechanism comprises a reciprocating device, a sliding block, a
pressure sensor and an arc-shaped grinding
assembly, wherein the reciprocating device is fixed to the cross beam, the sliding block is slidably connected with the corresponding grindingguide rail, and the reciprocating device drives the sliding block to reciprocate on the corresponding grinding guide rail; the top of the
pressure sensor is fixedly connected with the sliding block, and the bottom of the
pressure sensor is fixedly connected with the arc-shaped grinding
assembly; and the arc-shaped grinding
assembly is arranged above the
integrated circuit chip. A
chip fixing mechanism is arranged at the inner bottom of the rack. The
integrated circuit chip is fixedly placed on the chip fixing mechanism. According to the high-precision automatic removing
machine, the grinding pressure is measured through the pressure sensors, and then the
working pressure and reciprocating frequency of the arc-shaped grinding assemblies are accurately controlled, so that the
adhesive removal effect is effectively ensured, and the production efficiency is improved.