High-precision automatic removing machine for back adhesive film of integrated circuit chip

An integrated circuit, high-precision technology, applied in the direction of circuits, electrical components, grinding racks, etc., can solve the problems of low product yield, difficult control of action accuracy, unsatisfactory cleaning effect, etc., to ensure the effect of glue removal and production The effect of high efficiency and low cost

Inactive Publication Date: 2018-10-26
CHANGZHOU COLLEGE OF INFORMATION TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Existing integrated circuit chip back glue cleaning machines all use flat or roller-shaped grinding tools, which have the problems of difficult control of motion accuracy and unsatisfactory cleaning effect, resulting in low product yield

Method used

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  • High-precision automatic removing machine for back adhesive film of integrated circuit chip
  • High-precision automatic removing machine for back adhesive film of integrated circuit chip
  • High-precision automatic removing machine for back adhesive film of integrated circuit chip

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] See Figure 1 to Figure 4 , the high-precision automatic cleaning machine for integrated circuit chip adhesive film of this embodiment includes a frame 1, a grinding mechanism 2 and a chip fixing mechanism 3.

[0033] The top of the frame 1 is provided with a beam 1-1, and the middle part is provided with a grinding guide rail 1-2. A plurality of grinding mechanisms 2 are equidistantly installed on the beam 1-1 of the frame 1. The chip fixing mechanism 3 is arranged on the inner bottom of the rack 1 , and the integrated circuit chip 4 is fixedly placed on the chip fixing mechanism 3 .

[0034] The grinding mechanism 2 includes a reciprocating drive device 2-1, a slider 2-2, a pressure sensor 2-3, a bow-shaped grinding assembly 2-4 and a fine adjustment assembly 2-5. The reciprocating driving device 2-1 is fixed on the crossbeam 1-1. The slide block 2-2 is slidably connected with the grinding guide rail 1-2. The reciprocating driving device 2-1 drives the slide block...

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PUM

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Abstract

The invention discloses a high-precision automatic removing machine for a back adhesive film of an integrated circuit chip. A cross beam is arranged at the top of a rack, and a plurality of grinding guide rails are arranged in the middle of the rack. The grinding mechanisms are mounted on the cross beam of the rack at equal intervals. Each grinding mechanism comprises a reciprocating device, a sliding block, a pressure sensor and an arc-shaped grinding assembly, wherein the reciprocating device is fixed to the cross beam, the sliding block is slidably connected with the corresponding grindingguide rail, and the reciprocating device drives the sliding block to reciprocate on the corresponding grinding guide rail; the top of the pressure sensor is fixedly connected with the sliding block, and the bottom of the pressure sensor is fixedly connected with the arc-shaped grinding assembly; and the arc-shaped grinding assembly is arranged above the integrated circuit chip. A chip fixing mechanism is arranged at the inner bottom of the rack. The integrated circuit chip is fixedly placed on the chip fixing mechanism. According to the high-precision automatic removing machine, the grinding pressure is measured through the pressure sensors, and then the working pressure and reciprocating frequency of the arc-shaped grinding assemblies are accurately controlled, so that the adhesive removal effect is effectively ensured, and the production efficiency is improved.

Description

technical field [0001] The invention relates to a high-precision automatic cleaning machine for the back adhesive film of an integrated circuit chip. Background technique [0002] In the preparation and packaging process of integrated circuit chips, adhesive backing will inevitably be formed, which will affect the conductive effect of the circuit and the reliability of soldering and installation. Therefore, it is necessary to remove the glue on the mounting surface. Existing integrated circuit chip adhesive cleaning machines all use flat or roller-shaped grinding tools, which have the problems of difficult control of motion accuracy and unsatisfactory cleaning effect, resulting in low product yield. Contents of the invention [0003] The purpose of the present invention is to provide a high-precision automatic cleaning machine for the adhesive film on the back of an integrated circuit chip, so as to improve production efficiency. [0004] The technical solution for reali...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B27/033B24B27/00B24B41/06B24B41/02B24B41/00H01L21/67
CPCB24B27/033B24B27/0076B24B41/007B24B41/02B24B41/06H01L21/67126
Inventor 周彩根徐来孙琳张涌吴嘉宝刘中华陈维燕丁建峰刘丹
Owner CHANGZHOU COLLEGE OF INFORMATION TECH
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