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Tin-isolated flexible circuit board PAD and manufacturing method thereof

A technology for flexible circuit boards and manufacturing methods, which is applied to printed circuits, printed circuits, printed circuit components, etc., can solve the problems of lower yield, yield loss, and insufficient tin content, etc., to increase yield and reduce yield loss effect

Pending Publication Date: 2018-09-07
苏州维信电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, the flexible circuit board needs to be tinned by SMT on its empty PAD (pad), and then do hot bar (hot-press melting soldering) for the customer. There are through holes on the empty PAD of the flexible circuit board. It will flow to the back side through the through hole, resulting in insufficient tin on the front side. The customer's design has limitations, that is, the through hole cannot be canceled, and the tinning process cannot be transferred to another flexible circuit board, which will eventually lead to the loss of yield > 1%, reduced yield

Method used

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  • Tin-isolated flexible circuit board PAD and manufacturing method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0026] Such as figure 1 Shown is an embodiment 1 of a tin-separated flexible circuit board PAD according to the present invention. The flexible circuit board PAD1 is provided with a through hole 2, and one side of the flexible circuit board PAD 1 is also provided with a tin-separated slot 3. The X-direction dimension of the tin bath 3 is 70% of the X-direction dimension of the flexible circuit board PAD 1, the Y-direction dimension of the tin bath 3 is 6% of the Y-direction dimension of the flexible circuit board PAD 1, and the depth of the tin bath 3 is 4 μm, the distance between the tin slot 3 and the through hole 2 is 9% of the Y-direction dimension of the flexible circuit board PAD 1 , and the cross section of the tin slot 3 is rectangular.

[0027] The manufacturing method of this embodiment is as follows: the surface of the flexible circuit board PAD1 is plated with gold and nickel to form a gold-plated nickel layer, and the spacers are sequentially etched on the gold-pl...

Embodiment 2

[0029] The difference from Example 1 is that the X-direction dimension of the tin slot 3 is 50% of the X-direction dimension of the flexible circuit board PAD 1, and the Y-direction dimension of the tin slot 3 is 4 of the Y-direction dimension of the flexible circuit board PAD 1. %, the depth of the tin slot 3 is 5 μm, the distance between the tin slot 3 and the through hole 2 is 10% of the Y-direction dimension of the flexible circuit board PAD 1, and the cross section of the tin slot 3 is circular.

[0030] The manufacturing method of this embodiment is as follows: the surface of the flexible circuit board PAD 1 is plated with copper to form a copper plating layer, and a tin separation groove is etched on the copper plating layer and the surface of the flexible circuit board PAD 1 with a laser according to the preset size and distance 3. Protect the tin tank 3, and then carry out chemical immersion gold to form an immersion gold layer.

Embodiment 3

[0032] The difference from Example 1 is that the X-direction dimension of the tin slot 3 is 60% of the X-direction dimension of the flexible circuit board PAD 1, and the Y-direction dimension of the tin slot 3 is 8 of the Y-direction dimension of the flexible circuit board PAD 1 %, the depth of the tin slot 3 is 2.5 μm, the distance between the tin slot 3 and the through hole 2 is 8.5% of the Y-direction dimension of the flexible circuit board PAD1, and the cross section of the tin slot 3 is elliptical.

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Abstract

The invention provides a tin-isolated flexible circuit board PAD. A through hole is formed in the flexible circuit board PAD, and a tin isolating groove is further formed in one surface of the flexible circuit board PAD. The invention also provides a manufacturing method of the tin-isolated flexible circuit board PAD. According to the flexible circuit board PAD provided by the invention, the flowing of tin can be blocked effectively, the yield loss is reduced, and the rate of finished products is improved.

Description

technical field [0001] The invention relates to a tin-insulated flexible circuit board PAD and a manufacturing method thereof. Background technique [0002] At present, the flexible circuit board needs to be tinned by SMT on its empty PAD (pad), and then do hot bar (hot-press melting soldering) for the customer. There are through holes on the empty PAD of the flexible circuit board. It will flow to the back side through the through hole, resulting in insufficient tin on the front side. The customer's design has limitations, that is, the through hole cannot be canceled, and the tinning process cannot be transferred to another flexible circuit board, which will eventually lead to the loss of yield > 1%, reducing the yield. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide a tin-isolated flexible circuit board PAD, which can effectively block the flow of tin, reduce yield loss and increase yield. [0004] In orde...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/11H05K3/40
CPCH05K1/116H05K1/118H05K3/40H05K2201/09381H05K2201/09427
Inventor 朱澄
Owner 苏州维信电子有限公司
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