Chip radiator pasting mechanism
A heat sink and chip technology, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as low work efficiency and low product pass rate, and achieve the effect of improving work efficiency and product pass rate
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[0021] The present invention will be further described below in conjunction with the accompanying drawings. The following examples are only used to illustrate the technical solution of the present invention more clearly, but not to limit the protection scope of the present invention.
[0022] Such as figure 1 , figure 2 As shown, a chip radiator sticking mechanism 301 includes an integrated circuit board feeding mechanism, a heat sink feeding mechanism, a sticking mechanism 301, a static pressure mechanism 4 and a blanking mechanism;
[0023] The integrated circuit board feeding mechanism includes a first conveying mechanism 101, a second conveying mechanism 102, an unloading elevator 103 and a loading elevator 104, and the second conveying mechanism 102 is located below the first conveying mechanism 101; The circuit boards are laid flat on the first conveying mechanism 101 in sequence, and are transported by the first conveying mechanism 101 to the unloading elevator 103. ...
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