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System and method for hyperspectral imaging metrology

A metrology system and hyperspectral technology, applied in the field of hyperspectral imaging metrology, can solve problems such as increasing measurement acquisition time

Active Publication Date: 2018-09-28
KLA TENCOR TECH CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, typical methods for producing multiple scatterometry measurements increase measurement acquisition time and / or reduce the light associated with each measurement relative to a single measurement.

Method used

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  • System and method for hyperspectral imaging metrology
  • System and method for hyperspectral imaging metrology
  • System and method for hyperspectral imaging metrology

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Embodiment Construction

[0017] Reference will now be made in detail to the disclosed subject matter illustrated in the accompanying drawings. The invention has been particularly shown and described with respect to certain embodiments and specific features thereof. The embodiments set forth herein are to be regarded as illustrative rather than restrictive. It will be readily apparent to those skilled in the art that various changes and modifications in form and details can be made without departing from the spirit and scope of the invention.

[0018] generally refer to Figures 1 to 6 , disclosing a system and method for hyperspectral imaging metrology according to one or more embodiments of the present invention. Embodiments of the invention relate to a hyperspectral metrology system for simultaneously measuring multiple metrology images associated with multiple wavelengths on a single detector. Additional embodiments of the invention relate to measuring spectrally resolved illumination associated...

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Abstract

A metrology system includes an illumination source configured to generate an illumination beam, one or more illumination optics configured to direct the illumination beam to a sample, one or more collection optics configured to collect illumination emanating from the sample, a detector, and a hyperspectral imaging sub-system. The hyperspectral imaging sub-system includes a dispersive element positioned at a pupil plane of the set of collection optics configured to spectrally disperse the collected illumination, a lens array including an array of focusing elements, and one or more imaging optics. The one or more imaging optics combine the spectrally-dispersed collected illumination to form an image of the pupil plane on the lens array. The focusing elements of the lens array distribute thecollected illumination on the detector in an arrayed pattern.

Description

[0001] Cross References to Related Applications [0002] This application asserts under 35 U.S.C. §119(e) the title "Hyperspectral Imaging in Superposition Scatterometry" filed February 2, 2016 naming Andrew V. Hill as inventor (HYPER SPECTRALIMAGING IN OVERLAY SCATTEROMETRY)", U.S. Provisional Application Serial No. 62 / 290,157, which is hereby incorporated by reference in its entirety. [0003] This application asserts under 35 U.S.C. §119(e) the title "System for Hyperspectral Imaging Metrology" filed July 21, 2016 naming Andrew V. Hill as inventor SYSTEM AND METHOD FOR HYPERSPECTRAL IMAGING METROLOGY," U.S. Provisional Application Serial No. 62 / 365,120, which is incorporated herein by reference in its entirety. technical field [0004] The present invention relates generally to metrology, and more particularly, the present invention relates to hyperspectral imaging metrology. Background technique [0005] Instead of and / or in addition to measuring an image of a sample,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01J3/44G01N21/95
CPCG01N21/9501G01N21/95623G03F7/70616G01J3/2823G01J3/4412G01J2003/2826G01J3/0208G01J3/0229G01J3/0262G02B3/0006G02B27/1013G02B27/4205G01J3/44G01N21/4788G01N21/4795G01N2021/4709G01N2021/4711G01N2021/8461G02B27/10G01J3/00G03F7/706851
Inventor 安德鲁·V·希尔
Owner KLA TENCOR TECH CORP
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